Description: Achronix Semiconductor Corporation is a fabless semiconductor corporation based in Santa Clara, California, offering high-performance FPGA solutions. Achronix is the only supplier to have both high-performance and high-density standalone FPGAs and embedded FPGA (eFPGA) solutions in high-volume production. Achronix FPGA, eFPGA IP, and chiplet offerings are further enhanced by ready-to-use PCIe accelerator cards targeting AI, ML, networking, and data center applications. All Achronix products are supported by best-in-class EDA software.
Description: Our fundamental innovations shape the way millions of people explore and experience entertainment and enhance billions of devices in an increasingly connected world. From TVs to smartphones, in almost any place you can think of, from home to work to on the go, and in all types of entertainment experiences, from Pay-TV to OTT, managing content and connections in a way that is smart, immersive and personal is precisely what our innovations do.
Description: AMT provides test wafers that include cutting-edge technology for research and development of CMP, deposition, etching, and TSV. We change the type and thickness of the film of wafers on demand.
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Description: Our leading-edge technology advances push the boundaries of wired connectivity capabilities, enabling data to travel faster, more reliably, and using lower power. Powering next generation technologies, we serve Tier-One customers in North America, Asia Pacific, Europe, and the UK. Our innovative solutions have repeatedly set industry benchmarks in terms of performance, power consumption, size, and flexibility.
Description: Arm technology is defining the future of computing. Our energy-efficient processor designs and software platforms have enabled advanced computing in more than 250 billion chips and our technologies securely power products from the sensor to the smartphone and the supercomputer. Together with 1,000+ technology partners, we are enabling artificial intelligence to work everywhere, and in cybersecurity, we are delivering the foundation for trust in the digital world – from chip to cloud. The future is being built on Arm.
Description: Averatek is a Silicon Valley innovation company that develops technology for next-generation electronics: key chemistries and advanced manufacturing processes for the fabrication of ultra high-density printed circuit boards (UHDI), semiconductor packaging, RF and millimeter-wave passive components, 3D patterning, simplified assembly to aluminum
Description: Blue Cheetah provides highly optimized, rapidly customized die-to-die interconnect IP. Our chiplet interconnect IP solutions are configurable for packaging type, data rate, I/O configuration, process, and more. They are optimized to meet your application's power, performance, area, and latency requirements. Our BlueLynx technology is based on the Bunch of Wires (BoW) open die-to-die (D2D) interface from the Open Compute Project (OCP) and supports Universal Chiplet Interconnect Express (UCIe). Our solutions support both standard organic chip packaging and advanced packaging technology.
Description: Created in 1945 to implement a major political project – developing all applications from atomic sciences – the CEA remains the instrument used by public authorities to conduct research presenting major strategic and societal issues. . As part of this mission, the CEA develops new scientific knowledge and transfers technological innovations to the industrial world.
Description: Cadence is a leader in semiconductor IP addressing hyperscale computing, enterprise, data center, automotive, and artificial intelligence / machine learning (AI/ML) applications. The memory IP portfolio spans DDR, LPDDR, GDDR, and HBM protocols, and our family of IP for PCI Express® includes support for PCIe® 6.0/5.0/4.0/3.0/2.0/1.1 as well as CXL. The high-speed SerDes in 112G and 56G address the needs of hyperscalers designing products for 400G and 800G networks as well as 5G basestations. Our die-to-die connectivity products address multi-chip, multi-die implementation in 2.5D interposer packages and are ideally suited for the disaggregated CPUs, GPUs, and complex heterogenous SoCs that are pushing the limits of Moore’s Law.
Description: We offer comprehensive services encompassing chip design, simulation, and manufacturing, leveraging the integration of chiplets and heterogeneous components. Our organization represents a collaborative ecosystem founded by pioneering semiconductor and electronics companies based in the United States.
Description: Chroma is a world leading manufacturer of complete electronic test and measurement solutions for commercial, automotive, military and government industries. Utilizing in-house automated handling and manufacturing execution system (MES) expertise, Chroma specializes in integrated and fully automated turn-key electronic test and manufacturing solutions for technologies including semiconductor, optoelectronic, solar cell/module, and battery formation, test & grading production solutions.
Description: Credo's mission is to deliver high-speed solutions that break bandwidth barriers on every wired connection in the data infrastructure market. We provide innovative, secure, high-speed connectivity solutions that deliver improved power and cost efficiency as data rates and corresponding bandwidth requirements increase exponentially throughout the data infrastructure market.
Description: We address fundamental problems in distributed systems using protocols, data structures and algorithms inspired by Quantum Information Theory. Our market is next generation platforms for secure, reliable, cutting edge, distributed computing. We provide 5G network slices with a fundamentally more secure graph confinement architecture. Initial use-cases include Digital Twins, Multiplayer Games and Web 3.0.
Description: Deca was born of a passion to transform the way the world builds advanced electronic devices. In our first decade, our 10X thinking brought to life exciting breakthroughs for leading mobile semiconductor companies. From initial applications in traditional semiconductor packaging, to the growth of chiplets and heterogeneous integration, we have created key foundational building blocks for the future.
Description: Dream Big Semiconductor is an emerging semiconductor startup that is dedicated to providing comprehensive low cost, low latency and high throughput SMARTNIC solutions for datacenters and storage acceleration. Headquartered in San Jose, Dream Big Semiconductor has offices in different regions across the world for R&D cost optimization. Dream Big Semiconductor has also established strategic partnerships with global leaders in the ecosystem.
Description: Eliyan has developed a breakthrough die-to-die interconnect architecture that delivers new levels of high bandwidth and low latency at best-in-class area and power efficiency. Its NuLink™PHY for die-to-die interconnect, delivers performance, power, and area efficiency that no other technology can offer, on both silicon and organic substrates. Eliyan offers both chiplet and hard IP products that enable high-performance and efficient integration of chiplets. It solutions are compliant with UCIe and BoW specfications
Description: Ferric is the maker of power chiplets. These chiplets are fully integrated voltage regulators for low voltage and mid to high current level applications. Ferric’s converters are ideal for powering CPUs/GPUs/NPUs or FPGAs in package or on PCBs.
Description: Flex Logix is a reconfigurable computing IP company providing leading edge eFPGA, digital signal processing (DSP) and AI Inference technologies for semiconductor and systems companies. Flex Logix eFPGA enables volume FPGA users to integrate the FPGA into their companion SoC, resulting in a 5-10x reduction in the cost and power of the FPGA and increasing compute density which is critical for communications, networking, data centers, microcontrollers and others. Its scalable DSP AI inference is the most efficient, providing much higher inference throughput per square millimeter and per watt. Flex Logix is headquartered in Mountain View, California and has an office in Austin, Texas. For more information, visit https://flex-logix.com.
Description: Adaptivity is an indispensable property for the connected world of tomorrow. Intelligent electronic components can detect, evaluate and react accordingly to changes in their environment or within themselves. As a partner to industry, Fraunhofer IIS/EAS develops key technologies for such adaptive systems and offers you innovative and robust solutions.
Description: GLOBAL UNICHIP CORP. (GUC) is the Advanced ASIC Leader who provides the semiconductor industry with leading IC implementation and SoC manufacturing services, using advanced process and packaging technology. Based in Hsinchu, Taiwan, GUC has developed a global reputation with a presence in China, Europe, Japan, Korea, North America and Vietnami. GUC is publicly traded on the Taiwan Stock Exchange under the symbol 3443. For more information, visit www.guc-asic.com
Description: Hyperion designs, manufactures, and assembles advanced microelectronic packaging systems. Based in the United States, Hyperion is uniquely positioned as an end-to-end microelectronic systems provider. Our innovation addresses many technology and supply chain issues critical to the semiconductor industry. With deep domain expertise and a combination of novel materials and processes, we are scaling microelectronic systems towards higher performance, lower power consumption, and increased density. Hyperion offers unparalleled system-level differentiations to our customers. As an end-to-end microelectronics packaging solution provider, we offer direct-to-end user service.
Description: ISC, a global No.1 company that pursues rapid creation through innovation, develop and produce test sockets necessary to test semiconductor IC chips used in semiconductors, IT, BT, automobiles and various electronic parts, and as an industry-leading technological innovation company, we develop a variety of products optimized for each semiconductor package type in a short period of time to provide the best solution to our customers who need products of various types and small quantities.
Description: We are the discerning I, the test lab of the future, established with a staunch purpose to build upon the cutting edge, leading edge ATE test development, load board development capability and provide the secondary extension of electrical test which is to validate a new product, a new process, or a new package.
Description: Since 1986, Ironwood Electronics has been the go-to source for advanced adapters, sockets, and modules. Our adapters convert package and pitch between devices, our modules offer complete fully tested assemblies for component replacement and upgrade, and our sockets allow for complete component and assembly testing - from new silicone characterization and validation, all the way thru burn-in and high volume automated testing – always with the highest performance and lowest possible footprint in the industry.
Description: The Keysight Modern Design Center makes Chiplet design accessible from design to simulation and test using tightly integrated software and hardware that simplifies and accelerates time-to-insight. Our tools enable designers to create more complex and sophisticated designs in a shorter amount of time. It provides them with a higher-level abstraction layer to explore a wider range of design scenarios without having to spend time with manual and repetitive tasks.
Description: Kiwimoore is a provider of advanced packaging chiplet technology for its customers.
Description: Mirabilis Design provides chiplet and UCIe system-level IP, modeling templates and architecture-trade-off platforms. The system-level IP contains timing, all the settings as parameters, power, thermal and protocol functionality. The modeling templates contains various AI, parallel processors, GPU, memory, analog and IO chiplet models that can be used to test, analyze, optimize and validate the system system. Mirabilis Design has over 80 customers in semiconductors, embedded systems and software. The company is based in Santa Clara, CA, USA and has development and support centers in India, Germany, South Korea, China and Japan.
Description: Mycronic is a world-leading provider of flexible, high-precision production solutions for electronics manufacturing. We strive to keep our customers at the forefront of the industry by offering innovative, sustainable, high-quality production solutions with long product life cycles – solutions designed around the people who use them.
Description: Movellus is a leader in Intelligent Clock Networks™. Customers integrate our IP into an array of applications ranging from ultra-low power edge AI devices to performance centric cloud datacenter compute and AI offerings. Headquartered in San Jose with R&D centers in Michigan and Toronto, Movellus has introduced patented architectural innovations that significantly improve clock network performance, enabling the next generation of complex integrated circuits.
Description: The Open Compute Project (OCP) is a global collaborative Community working with the product and solution vendor ecosystem to develop open innovations deployable from the cloud to the edge. The OCP Foundation is responsible for meeting the market and shaping the future, taking hyperscale-led innovations to everyone. Meeting the market is accomplished through addressing challenging market obstacles with open specifications, designs and data center facility best practices. Shaping the future includes investing in strategic initiatives and programs that prepare the IT ecosystem for major technology changes. OCP Community-developed open innovations strive to benefit all, optimized through the lens of impact, efficiency, scale and sustainability.
Description: Palo Alto Electron offers product development for chiplet-based heterogeneous ICs and systems. We are an active participant of OCP/ODSA/CDX. The team is from the former zGlue which was one of the first companies to develop chiplet technology specializing in IoT. We are based in Palo Alto.
Description: Our mission is simple: solve your complex component assembly challenges. Promex has a long history in Silicon Valley, dating back to its founding in 1975. The company is privately held and has been under current management since 1995. In 2008, Promex pivoted to focus on the unique demands of the medical device and biotech market.
Description: proteanTecs is the leading provider of deep data analytics for advanced electronics monitoring. Trusted by global leaders in the datacenter, automotive, communications and mobile markets, the company provides system health and performance monitoring, from production to the field. By applying machine learning to novel data created by on-chip monitors, the company's deep data analytics solutions deliver unparalleled visibility and actionable insights—leading to new levels of quality and reliability. Founded in 2017 and backed by world-leading investors, the company is headquartered in Israel and has offices in the United States, India and Taiwan. For more information, visit www.proteanTecs.com.
Description: We are a fabless semiconductor company that develops innovative embedded FPGA (eFPGA) IP, discrete FPGAs, and FPGA SoCs for a variety of industrial, aerospace and defense, edge and endpoint AI, consumer, and computing applications.
Description: Founded in 2011, Sarcina Technology is a semiconductor packaging and testing turnkey company in Palo Alto, California, USA with a design and supply chain management office in Hsinchu, Taiwan. It is led by industrial veterans from places like AT&T Bell Labs, DEC, Intel and TSMC. Sarcina Technology provides leading US companies with package design and power/signal integrity simulation. In addition, Sarcina offers wafer probing and final test hardware design, test program development, and one-stop turnkey service.
Description: Siemens EDA - The pace of innovation in electronics is constantly accelerating. To enable customers to deliver life-changing innovations faster and become market leaders, we are committed to delivering the world’s most comprehensive portfolio of electronic design automation (EDA) software, hardware, and services.
Description: Silicon Catalyst is the world’s only incubator + accelerator focused on semiconductor solutions, including Photonics, MEMS, sensors, IP, materials and Life Science. We accelerate startups from idea through prototype, and onto a path to volume production. We have engaged with more than 1,000 semiconductor startups worldwide and have admitted over 100 exciting companies. In addition, our UK government funded early-stage incubator launched its first cohort of 12 startups on October 1, 2023.
Description: Silitronics' leading-edge technology advances push the boundaries of wired connectivity capabilities, enabling data to travel faster, more reliably, and using lower power. Powering next generation technologies, we serve Tier-One customers in North America, Asia Pacific, Europe, and the UK. Our innovative solutions have repeatedly set industry benchmarks in terms of performance, power consumption, size, and flexibility.
Description: Discover how we’re driving innovation & adding significant value to businesses worldwide — and meet the people who make it possible.
Description: Sofics is a foundry independent semiconductor IP provider that has supported 100+ companies worldwide with specialty on-chip ESD protection and unique I/O circuits. The IP designs are integrated into more than 5000 IC designs across many different applications. The Sofics technology is silicon proven on more than 50 different processes from leading foundries like TSMC, Samsung Foundry, GlobalFoundries and several others. Sofics on-chip ESD protections, Analog & Digital IO can enable higher performance, higher ESD robustness, reduce design time and costs.
Description: Synopsys (Nasdaq: SNPS) is the Silicon to Software™ partner for innovative companies developing the electronic products and software applications we rely on every day. Learn more at www.synopsys.com.
Description: Innovation begins with Us! Technoprobe (XMIL: TPRO) is a leading provider of the most advanced wafer test solutions for the semiconductor industry. The company specializes in design, development, and manufacturing of leading-edge wafer probe cards. Our mission is to be a strategic partner and to be vital to our customers’ overall success. Technoprobe offers a comprehensive product portfolio capable of meeting complex testing requirements and reducing the overall cost of test. Our culture to drive Innovation leads us to explore new concepts, to push Technology beyond its limits, and to use customization as a guiding principle to enable the next generation products. Visit us at www.technoprobe.com for more information.
Description: Teradyne test technology helps bring high-quality innovations such as smart devices, life-saving medical equipment and data storage systems to market, faster. Its advanced test solutions for semiconductors, electronic systems, wireless devices and more ensure that products perform as they were designed. Its robotics offerings include collaborative and mobile robots that help manufacturers of all sizes increase productivity, improve safety, and lower costs. In 2022, Teradyne had revenue of $3.2 billion and today employs over 6,500 people worldwide. For more information, visit teradyne.com.
Description: We believe in reducing power dissipation in semiconductor devices. It is our mission to enable Everyone involved with semiconductor design better understand, plan and optimize power dissipation of their devices. For this we have developed PowerMeter™ - an innovative platform for full chip and system power dissipation analysis. Founded in 2018, Thrace Systems is a privately-held Electronic Design Automation company. We are headquartered in San Jose, CA, USA, with extended team in Bulgaria, EU. Our founder started his career in the Semiconductor industry in the distant 1999 at LSI Logic Corp, and has worked on power related aspects ever since, including power planning, power grid design, power analysis, mower correlation and power modeling.
Description: Founded in 2017, Tuple Tech addresses Cloud, DevSecOps, & Managed Services challenges in Science, Engineering, and Business. Our solutions optimize IT infrastructure with leading Cloud platforms, enabling browser-based access to legacy applications and on-demand execution through provisioned compute resources. Reduce IT costs with our pay-as-you-go approach and resource monitoring.
Description: VeriSilicon Microelectronics is committed to providing customers with platform-based, all-round, one-stop custom silicon services and semiconductor IP licensing services leveraging its in-house semiconductor IP. Under the unique "Silicon Platform as a Service" (SiPaaS) business model, depending on the comprehensive IP portfolio, VeriSilicon can create silicon products from definition to testing and packaging in a short period of time, and provides high performance and cost-efficient semiconductor alternative products for fabless, IDM, system vendors (OEM/ODM), large internet companies and cloud service providers, etc.
Description: Xpeedic is a leading provider of simulation-centric EDA solution. Its differentiating chip-package-system solution enables customers to shorten their design cycle and thus improve time to market. Xpeedic customers include the world’s top companies in mobile, IoT, HPC, datacenter, and automotive.
Description: Yole Group is an international company, recognised for its expertise in the analysis of markets, technological developments and supply chains, as well as the strategy of key players in the semiconductor, photonic and electronic sectors. Yole Group's business is based on daily interactions with a network of major operators in these industries, built on mutual trust over the years. We provide our clients, industrial companies, investors and R&D organizations worldwide, with market research, technology, strategy and cost analysis, as well as financial advisory services, to help them in their decision-making about their future business strategy in the semiconductor industry.
Description: Digitalization quickly accelerates energy consumption and is projected to stand for more than one-fifth of global electricity demand by 2030. Maximizing performance per watt in servers and smart devices is critical to breaking the trend.
Description: Our computing platform accelerates the myriad of applications powered by transformer models across cloud and enterprise markets. We exist to serve your purpose.