Description: The 3D InCites Community was established in 2009 to stir up interest in 3D integration. Now in its 13th year, 3D InCites has broadened its scope stir up interest in heterogeneous integration. As such, 3D InCites is about much more than just through-silicon vias and subsequent stacking technologies. Rather, 3D InCites has become part of the whole advanced packaging conversation as it relates to heterogeneous integration, the internet of things, and other applications these technologies enable. The goal is to inform key decision-makers about progress in technology development, design, standards, infrastructure, and implementation.
Description: Apex Semiconductor Inc. was founded in 2018 by a team of Silicon Valley veterans with over 25 years of experience. We have a proven track record in delivering complex, high-performance, and low-power chip and system designs using bleeding-edge process technology nodes. We are headquartered in Santa Clara, California and have a design center in Bangalore, India. At Apex, we’re building an AI-powered chip design software and methodology along with an interchip enablement technology to revolutionize the economics of SoC design and path to production for our customers. We extensively use this platform to provide customers with full turnkey ASIC implementation all the way to production. Apex’s software runs alongside existing EDA tools and uses a combination of predictive analysis and learning from human-based best practices, both of which minimize design iterations and reduce time spent by human experts on analyzing tool-generated reports. Our in-house data science team is equipped with world-class AI experts with semiconductor backgrounds and key related patents, positioning us very well to help disrupt the economics of SoC realization.
Description: ASE is a primary architect of Heterogeneous Integration (HI) - the technology that integrates separately manufactured components into a higher level assembly (System-in-Package or SiP) that in the aggregate provides enhanced functionality and improved operational characteristics.
Description: ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, Automotive, High Performance Computing and more. To learn about our advances in SiP, Fanout, MEMS & Sensor, Flip Chip, and, 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com or follow us on Twitter: @asegroup_global.
Description: Intelligent server adapters, or SmartNICs, boost server performance in cloud and private data centers by offloading network processing workloads and tasks from server CPUs. Offloading network processing to a SmartNIC is not a new concept — for example, there are NICs that offload some network-processing functions such as checksum computation and segmentation. However, the rapid explosion in data-center network traffic driven by software-defined networking (SDN), Open vSwitch (OVS), and network functions virtualization (NFV) demands a new class of NIC with even greater offload capabilities: the SmartNIC.
Description: Our fundamental innovations shape the way millions of people explore and experience entertainment and enhance billions of devices in an increasingly connected world. From TVs to smartphones, in almost any place you can think of, from home to work to on the go, and in all types of entertainment experiences, from Pay-TV to OTT, managing content and connections in a way that is smart, immersive and personal is precisely what our innovations do.
Description: Realizing Innovation with a Dependable Trusted Silicon Partner. Due to ever increasing SoC complexities, design risks and design costs, it is critical to establish long term ASIC partnerships. As a leading provider of silicon design and manufacturing services, Alchip is committed to partnering with our customers to deliver the most innovative solutions while minimizing risk and reducing costs. Our world class teams provide the fastest time-to-market SoC design & manufacturing solutions at aggressive price points so our customers can succeed in the increasingly competitive market. We have been able to help our customers and our partners grow, and we are highly focused on developing long term partnerships with our customers.
Description: Our leading-edge technology advances push the boundaries of wired connectivity capabilities, enabling data to travel faster, more reliably, and using lower power. Powering next generation technologies, we serve Tier-One customers in North America, Asia Pacific, Europe, and the UK. Our innovative solutions have repeatedly set industry benchmarks in terms of performance, power consumption, size, and flexibility.
Description: Advanced CFD/FEA simulators are great if you have the time to build up a detailed 3D model but often you need a quick and accurate answer to a heat transfer question and you just can't wait around for fully calibrated model. Advanced CFD/FEA solvers with steep learning curves don't make it easy to build up a model based on your intuition because you have to be good at 3D drawing, understand how all the boundary conditions should be set, and setup many control parameters for any simulation you will run before you get to a reasonable answer. Use Anemoi Thermal Solver to easily create a model today that gets you to a solution to thermal problems quickly.
Description: We are the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. Our innovations Make Possible a Better Future.
Description: Founded in 1999, Avery Design Systems, Inc. enables system and SOC design teams to achieve dramatic functional verification productivity improvements through the use of SystemVerilog / UVM Verification IP portfolio Virtual host/embedded QEMU and VIP / RTL system co-simulation Semi-Formal applications for X-verification FPGA-assisted acceleration, FPGA prototyping tools speed adapter IPs Avery is headquartered in Tewksbury, Ma. Avery also operates an R&D center in Taipei, Taiwan. Avery’s products are directly marketed and distributed throughout the U.S., China, Taiwan, Japan, Korea, and Israel Avery is private, self funded, and profitable.
Description: Blue Cheetah provides highly optimized, rapidly customized die-to-die interconnect IP. Our chiplet interconnect IP solutions are configurable for packaging type, data rate, I/O configuration, process, and more. They are optimized to meet your application's power, performance, area, and latency requirements. Our BlueLynx technology is based on the Bunch of Wires (BoW) open die-to-die (D2D) interface from the Open Compute Project (OCP) and supports Universal Chiplet Interconnect Express (UCIe). Our solutions support both standard organic chip packaging and advanced packaging technology.
Description: Cadence is a pivotal leader in electronic systems design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware, and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary electronic products from chips to boards to complete systems for the most dynamic market applications including hyperscale computing, 5G communications, automotive, mobile, aerospace, consumer, industrial, and healthcare. For eight years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For.
Description: Corigine is a fabless semiconductor company that designs and delivers leading edge I/O and networking products, IPs, and EDA tools. Founded in 2015, the company has R&D centers and sales offices worldwide including Santa Clara, Shanghai, Nanjing, Beijing, London, Centurion and Cape Town etc. The company is led by a team of renowned silicon professionals that have pioneered generations of innovations in the semiconductor industry.
Description: d-Matrix is led by a team of dedicated entrepreneurs with a 20+ year history in building businesses that have shipped over 100M chips and generated over $1B in revenue.
Description: Deca was born of a passion to transform the way the world builds advanced electronic devices. In our first decade, our 10X thinking brought to life exciting breakthroughs for leading mobile semiconductor companies. From initial applications in traditional semiconductor packaging, to the growth of chiplets and heterogeneous integration, we have created key foundational building blocks for the future. Our world class investors, including Infineon, Qualcomm, ASE, nepes and SunPower, are respected industry leaders who provide us with the strength and visibility to create an entirely new model.
Description: Dream Big Semiconductor is an emerging semiconductor startup that is dedicated to providing comprehensive low cost, low latency and high throughput SMARTNIC solutions for datacenters and storage acceleration. Headquartered in San Jose, Dream Big Semiconductor has offices in different regions across the world for R&D cost optimization. Dream Big Semiconductor has also established strategic partnerships with global leaders in the ecosystem.
Description: Our passion for science and technology is what drives our 62,770 employees in 66 countries to find solutions to some of today’s toughest challenges and create more sustainable ways to live. We are here for people at every step, helping to create, im-prove and prolong life. We deliver personalized treatments for serious diseases and enable people to achieve their dream of becoming parents. We empower the scientific community. Our tools, services and digital platform make research simpler, more exact, and help to deliver breakthroughs more quickly. Our solutions accelerate access to health by assuring tests are accurate and the medicine we take can be trusted. We are the company behind the companies, advancing digital living. Our science sits inside technologies that are changing the way we access, store, process, and display information. Our innovations are unlocking the power and potential of data to open new possibilities to transform life on Earth as we know it.
Description: eTopus designs ultra-high speed mixed-signal semiconductor solutions for high-performance computing and data center applications. Our ultra-high speed SerDes IP is adopted by global Tier-1 players to be used in networking, storage, 5G, and AI applications. eTopus was the first startup to demonstrate ADC/DSP-based SerDes at 56Gbps supporting the emerging PAM-4 standards as early as 2016. Our innovation in ADC/DSP-based physical layer transceiver technology delivers superior Bit Error Rate performance for Long Reach applications at low power consumption. The system architecture has been proven and matured over multiple generations of silicon. eTopus is a VC-backed startup headquartered in the center of Silicon Valley where our innovations and advanced architectures are developed. We have multiple locations in Hong Kong and Taiwan for design and customer support. Our investors include SK Telecom, HK-X, corporate VCs, and cross-border funds.
Description: Come visit us at the First Annual SmartNICs Summit. It is the show network designers can’t miss if they want to stay competitive in the networking world. They’ll get the scoop on ways to make their networks run faster, scale better, use less power, and be more flexible. Ralph Grundler is presenting "eFPGAs Bring the Advantages of Programmable Logic to SmartNICs" Wednesday B-101
Description: Our application-oriented research institute is a global leader in microelectronic and information technology system solutions and services. We are currently the largest institute within the Fraunhofer-Gesellschaft. We work with our customers and partners from the business and public sectors to develop, implement, and optimize processes, products, and systems through to use and market launch. Our internationally networked, cutting-edge research contributes to economic success and social well-being
Description: Hyperion designs, manufactures, and assembles advanced microelectronic packaging systems. Based in the United States, Hyperion is uniquely positioned as an end-to-end microelectronic systems provider. Our innovation addresses many technology and supply chain issues critical to the semiconductor industry. With deep domain expertise and a combination of novel materials and processes, we are scaling microelectronic systems towards higher performance, lower power consumption, and increased density. Hyperion offers unparalleled system-level differentiations to our customers. As an end-to-end microelectronics packaging solution provider, we offer direct-to-end user service. We specialize in system-level packaging for high-performance computing and heterogeneously integrated systems. Offering includes: chiplet designs, substrate design and fabrication, novel 3DIC interposers design and Fabrications. We offer manufacturing service for a wide array of market segments including; defense, aerospace, industrial, general-purpose client computing, and high-performance computing.
Description: Intrinsic ID is the world’s leading provider of security IP for embedded systems based on physical unclonable function or PUF technology. The technology provides an additional level of hardware security utilizing the inherent uniqueness in each and every silicon chip. The IP can be delivered in hardware or software and can be applied easily to almost any chip – from tiny microcontrollers to high-performance FPGAs – and at any stage of a product’s lifecycle. It is used as a hardware root of trust to validate payment systems, secure connectivity, authenticate sensors, and protect sensitive government and military data and systems. Intrinsic ID security has been deployed and proven in millions of devices certified by EMVCo, Visa, CC EAL6+, PSA, ioXt, and governments across the globe.
Description: Founded in Switzerland by Dr. Amin Shokrollahi, a university professor at EPFL and renowned mathematician, Kandou answers that very question by revolutionizing wired connectivity. To do so, we must break barriers. To do so, we must fly in the face of traditional thinking and convention, much like our spirit animal, the humble bee. It shouldn't be able to fly. Its wings are too small, its body is too big, and yet fly it does; achieving what shouldn't be possible. It is this spirit we operate with when pollinating new ideas and seeking true innovation. Bees were even the inspiration for our name — Kandou means "beehive" in Farsi. The collaborative approach found in beehives extends to our relationships with customers, investors and Tier 1 suppliers. We want to evolve the semiconductor and electronics industries to become the IO engine behind the world's biggest brands. Unlocking the power of your technology. We Kandou it.
Description: Mosaic Microsystems is a microelectronics and photonics packaging company focused on glass and other thin substrates as a platform material. We provide integration products and services for a range of microelectronics applications, photonics, RF/mmWave, MEMS and sensor technologies. Learn more about the industries we serve here. Mosaic has offices and clean room space at 1999 Lake Avenue and is headquartered at 500 Lee Road in Rochester, NY.
Description: Movellus is a leader in Intelligent Clock Networks™. Customers integrate our IP into an array of applications ranging from ultra-low power edge AI devices to performance centric cloud datacenter compute and AI offerings. Headquartered in San Jose with R&D centers in Michigan and Toronto, Movellus has introduced patented architectural innovations that significantly improve clock network performance, enabling the next generation of complex integrated circuits.
Description: The Open Compute Project (OCP) Community includes hyperscale data center operators and industry players, joined by telecom, colocation providers and enterprise IT users, working with vendors to develop and commercialize open innovations that, when embedded in product are deployed from the cloud to the edge.
Description: Palo Alto Electron develops cutting-edge electronic systems with Chiplets, Advanced Packaging, and Software. We offer an end-to-end solution from design to manufacturing for heterogeneous integrated circuits in collaboration with our top-tier American Chiplet Alliance Partners. Our smart fabric and smart substrate technologies enable power, performance, and cost differentiations. Visit our booth for more details
Description: proteanTecs is the leading provider of deep data analytics for advanced electronics monitoring. Trusted by global leaders in the datacenter, automotive, communications and mobile markets, the company provides system health and performance monitoring, from production to the field. By applying machine learning to novel data created by on-chip monitors, the company's deep data analytics solutions deliver unparalleled visibility and actionable insights—leading to new levels of quality and reliability. Founded in 2017 and backed by world-leading investors, the company is headquartered in Israel and has offices in the United States, India and Taiwan. For more information, visit www.proteanTecs.com.
Description: Robson Technologies, Inc. (RTI) designs and manufactures custom test interfaces that bridge the gap between your device under test and your test and measurement system. From simple IC test sockets on breakout boards to complex PCB test fixtures and automated curve tracing test systems, our test solutions are built to specification to meet your most demanding test requirements.
Description: The Storage Networking Industry Association is a not-for-profit global organization, made up of member companies spanning the storage market. As a recognized and trusted authority for storage leadership, standards, and technology expertise worldwide, SNIA’s mission is to lead the storage industry in developing and promoting vendor-neutral architectures, standards, and educational services that facilitate the efficient management, movement, and security of information.
Description: Founded in 2011, Sarcina Technology is a semiconductor packaging and testing turnkey company in Palo Alto, California, USA with a design and supply chain management office in Taipei, Taiwan. It is led by industrial veterans from places like AT&T Bell Labs, DEC, Intel and TSMC. Sarcina Technology provides leading US companies with package design and power/signal integrity simulation. In addition, Sarcina offers wafer probing and final test hardware design, test program development, and one-stop turnkey service.
Description: Siemens EDA - The pace of innovation in electronics is constantly accelerating. To enable customers to deliver life-changing innovations faster and become market leaders, we are committed to delivering the world’s most comprehensive portfolio of electronic design automation (EDA) software, hardware, and services.
Description: Silicon Catalyst is the world's only incubator + accelerator focused on semiconductor solutions, including Photonics, MEMS, sensors, IP, materials and Life Science. We accelerate startups from idea through prototype, and onto a path to volume production.
Description: Silitronics provides Design and Assembly solutions with “First Time Right” by co-working with customers after analyzing their needs and schedule. Silitronics has fully Automated Equipment along with Design and Modelling software to exceed customers’ design and assembly specifications. Silitronics team has expertise and hands on experience to propose, develop and implement cost effective solutions within schedule. Silitronics is centrally located in Silicon Valley, Santa Clara, CA in a 10,000+ square feet facility with Clean Room 10K and 1K.
Description: Synopsys technology is at the heart of innovations that are changing the way people work and play. Self-driving cars. Machines that learn. Lightning-fast communication across billions of devices in the datasphere. These breakthroughs are ushering in the era of Smart Everything―where devices are getting smarter and connected, and security is an integral part of the design. Powering this new era of innovation are high-performance silicon chips and exponentially growing amounts of software content. Synopsys is at the forefront of Smart Everything with the world’s most advanced technologies for chip design, verification, IP integration, and software security and quality testing. We help our customers innovate from silicon to software so they can bring amazing new products to life.
Description: UCIe™ (Universal Chiplet Interconnect Express™) is an open specification that defines the interconnect between chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level. AMD, Arm, Advanced Semiconductor Engineering, Inc. (ASE), Google Cloud, Intel Corporation, Meta, Microsoft, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company are dedicated to this open industry standard organization to promote and further develop the technology, and to establish a global ecosystem supporting chiplet design.
Description: Our global team is delivering a family of no-compromise, high-performance RISC-V data center-class CPUs with extensible instruction set capability delivered in the form of multi-core chiplets or core IP for high-performance applications in the cloud, enterprise data center, hyperscale, 5G, edge compute, AI/ML and automotive markets.
Description: VeriSilicon Microelectronics is committed to providing customers with platform-based, all-round, one-stop custom silicon services and semiconductor IP licensing services leveraging its in-house semiconductor IP. Under the unique "Silicon Platform as a Service" (SiPaaS) business model, depending on the comprehensive IP portfolio, VeriSilicon can create silicon products from definition to testing and packaging in a short period of time, and provides high performance and cost-efficient semiconductor alternative products for fabless, IDM, system vendors (OEM/ODM), large internet companies and cloud service providers, etc. VeriSilicon's business covers consumer electronics, automotive electronics, computer and peripheral, industry, data processing, Internet of Things (IoT) and other applications.
Description: Xpeedic is a leading provider of simulation-centric EDA solution. Its differentiating chip-package-system solution enables customers to shorten their design cycle and thus improve time to market. Xpeedic customers include the world’s top companies in mobile, IoT, HPC, datacenter, and automotive. Xpeedic Filter delivers the best-in-class RF filter for mobile and IoT market with its diversified filter technologies, in-house customized design tools, and stable foundry/package partnership.
Description: Yole Group is an international company, recognised for its expertise in the analysis of markets, technological developments and supply chains, as well as the strategy of key players in the semiconductor, photonic and electronic sectors. Yole Group’s business is based on daily interactions with a network of major operators in these industries, built on mutual trust over the years. We provide our clients, industrial companies, investors and R&D organizations worldwide, with market research, technology, strategy and cost analysis, as well as financial advisory services, to help them in their decision-making about their future business strategy in the semiconductor industry.