Exhibitor Name	Level	Booth
	Keynote	Booth: 206
Alphawave Semi is a global leader in high-speed connectivity for the world’s technology infrastructure. To find out more about Alphawave Semi, visit: awavesemi.com.
	Keynote	Sponsor
Arm technology is defining the future of computing. Our energy-efficient processor designs and software platforms have enabled advanced computing in more than 250 billion chips and our technologies securely power products from the sensor to the smartphone and the supercomputer. Together with 1,000+ technology partners, we are enabling artificial intelligence to work everywhere, and in cybersecurity, we are delivering the foundation for trust in the digital world – from chip to cloud. The future is being built on Arm.
	Keynote	Booth: 300
Cadence Silicon Solutions leverage decades of experience in IP and subsystems to power your advanced designs. The Cadence Silicon Solutions Portfolio includes silicon-proven Tensilica and Neo AI IP cores, advanced memory interfaces, and high-speed SerDes that are all based on industry-standard protocols. To achieve first-time silicon success, let Cadence help you choose the right IP, subsystem, or silicon solution and capture its full value in your design. Now you can tackle IP-to-SoC development in a system context, focus your internal effort on differentiation, and leverage multi-function cores to do more, faster. Choosing Cadence Silicon Solutions enables you to design with confidence because you have more freedom to innovate your designs with less risk
	Keynote	Sponsor
Marvell Technology is an American company, headquartered in Santa Clara, California, which develops and produces semiconductors and related technology. To find out more, visit: marvell.com.
	Keynote	Booth: 500
The Open Compute Project (OCP) is a global collaborative Community working with the product and solution vendor ecosystem to develop open innovations deployable from the cloud to the edge. The OCP Foundation is responsible for meeting the market and shaping the future, taking hyperscale-led innovations to everyone. Meeting the market is accomplished through addressing challenging market obstacles with open specifications, designs and data center facility best practices. Shaping the future includes investing in strategic initiatives and programs that prepare the IT ecosystem for major technology changes. OCP Community-developed open innovations strive to benefit all, optimized through the lens of impact, efficiency, scale and sustainability.
	Keynote	Booth: 200
Siemens EDA - The pace of innovation in electronics is constantly accelerating. To enable customers to deliver life-changing innovations faster and become market leaders, we are committed to delivering the world’s most comprehensive portfolio of electronic design automation (EDA) software, hardware, and services.
	Keynote	Booth: 400
Catalyzing the era of pervasive intelligence, Synopsys delivers trusted and comprehensive silicon to systems design solutions, from electronic design automation to silicon IP and system verification and validation. We partner closely with semiconductor and systems customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow. Learn more at www.synopsys.com.
	Keynote	Booth: 211
The UCIe Consortium is an industry consortium dedicated to advancing UCIe™ (Universal Chiplet Interconnect Express™) technology, an open industry standard that defines the interconnect between chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level. UCIe Consortium is led by key industry leaders Advanced Semiconductor Engineering, Inc. (ASE), Alibaba, AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, NVIDIA, Qualcomm Incorporated, Samsung Electronics, and Taiwan Semiconductor Manufacturing Company. For more information, visit www.UCIexpress.org.
Collateral from UCIe Consortium
UCIe 3.0 Specification Release Description: The UCIe 3.0 specification delivers 48/64 GT/s speeds for UCIe-S and UCIe-A to power next-gen multi-chip systems for evolving use cases, which demand higher bandwidth density, such as AI, by doubling the data rate while maintaining low power. Visit Link with the details
UCIe 3.0 Specification: Driving Innovation for Efficient, Scalable, and Reliabl Description: This white paper delves into the intricacies of the UCIe 3.0 specification features. Visit Link with the details
UCIe 3.0 Webinar Description: This webinar will delve into the new features in the UCIe 3.0 specification, including improvements to bandwidth density, power efficiency, enhanced manageability, and expanded design flexibility for scalable SiP architectures. Visit Link with the details
	Gold	Booth: 207
Keysight EDA is a world-class software engineering organization with deep roots in the EDA, semiconductor, and test industries. Our software experts conduct advanced R&D to architect high-performance design and simulation solutions that meet the most demanding needs of engineers developing silicon, boards, and systems. Keysight EDA’s silicon-to-system solutions are used by customers in wireless and wired communications and aerospace and defense markets in a wide variety of RF and microwave and high-speed digital applications.
Collateral from Keysight
Keysight Enables Enterprise-Scale AI Adoption in Semiconductor Design with SOS Description: Software automates engineering data governance and traceability across distributed organizations to accelerate AI integration Visit Link with the details
Keysight SOS Enterprise Description: AI-Ready Data Architecture: Built from day one for machine learning pipelines, analytics platforms, and intelligent automation. Your data doesn't just sit there — it works for you. Visit Link with the details
Chiplet 3D Interconnect Designer Description: Accelerate chiplet-based system design with a smarter Chiplet 3D interconnect designer. Visit Link with the details
High-Speed Digital Design Solutions for ADS 2026 Description: Keysight EDA’s High-Speed Digital Design Solutions for ADS 2026 Visit Link with the details
From Silos to Systems. From Data to Insight Description: Unlocking Organizational Knowledge and Winning in the AI Era with Keysight SOS Enterprise. Visit Link with the details
	Gold	Booth: 307
At NHanced Semiconductors, we pioneered advanced interconnect technologies like 3DICs, silicon interposers, chiplets, additive semiconductor manufacturing, and more. Our entire organization is located in the U.S.A. We collaborate with customers, tailoring our processes to suit the needs of their advanced device designs and bring them into volume production. We call our novel manufacturing model Foundry 2.0.
	Gold	Booth: 306
Tenstorrent is a next-generation computing company that builds computers for AI. For more information, visit: tenstorrent.com
	Bronze	Sponsor
Advantest (TSE: 6857) is the leading manufacturer of automatic test and measurement equipment used in the design and production of semiconductors for applications including 5G communications, the Internet of Things (IoT), autonomous vehicles, high performance computing (HPC) including artificial intelligence (AI) and machine learning, and more. Its leading-edge systems and products are integrated into the most advanced semiconductor production lines in the world.
	Bronze	Sponsor
Eliyan has developed a breakthrough die-to-die interconnect architecture that delivers new levels of high bandwidth and low latency at best-in-class area and power efficiency. Its NuLink™PHY for die-to-die interconnect, delivers performance, power, and area efficiency that no other technology can offer, on both silicon and organic substrates. Eliyan offers both chiplet and hard IP products that enable high-performance and efficient integration of chiplets. It solutions are compliant with UCIe and BoW specfications
	Bronze	Booth: 316
Menta SAS is a pioneering company in the semiconductor industry that has been redefining electronics design standards since it was founded in 2007. Menta, specializing as an IP provider, equips chip designers with eFPGA technology, an IP core that can be integrated into ASICs and SoCs. As the leader in eFPGA IPs, we embody excellence in innovation, offering customizable solutions of exceptional reliability. Our commitment to responsible progress, combining performance and sustainability, guides every step we take.
Collateral from Menta
Chiplets Reach an Architectural Turning Point – Menta at Chiplet Summit 2026 Description: Menta, a leading semiconductor IP company, will actively contribute at the upcoming Chiplet Summit 2026, where it will also outline the next phase of MOSAICS, its modular chiplet Visit Link with the details
	Bronze	Sponsor
Teradyne designs, develops, and manufactures automated test equipment and advanced robotics systems. Its test solutions for semiconductors and electronics products enable Teradyne's customers to consistently deliver on their quality standards. Its advanced robotics business includes collaborative robots and mobile robots that support manufacturing and warehouse operations for companies of all sizes. For more information, visit teradyne.com.
	Bronze	Booth: 418
VeriSilicon Microelectronics is committed to providing customers with platform-based, all-round, one-stop custom silicon services and semiconductor IP licensing services leveraging its in-house semiconductor IP. Under the unique "Silicon Platform as a Service" (SiPaaS) business model, depending on the comprehensive IP portfolio, VeriSilicon can create silicon products from definition to testing and packaging in a short period of time, and provides high performance and cost-efficient semiconductor alternative products for fabless, IDM, system vendors (OEM/ODM), large internet companies and cloud service providers, etc.
	Media	Booth: 316
Collateral from Electronic Design
Chiplets Reach an Architectural Turning Point – Menta at Chiplet Summit 2026 Description: Menta, a leading semiconductor IP company, will actively contribute at the upcoming Chiplet Summit 2026, where it will also outline the next phase of MOSAICS, its modular chiplet Visit Link with the details
	Exhibitor	Booth: 223
For over 43 years, Allied High Tech Products has provided sample preparation products for failure analysis to the microelectronics industry. Allied manufactures cutting-edge equipment at its facilities with all design, manufacturing and assembly taking place in-house to ensure the highest quality equipment is produced.
Collateral from Allied High Tech Products
MultiPrep Precision Polisher Description: The MultiPrep polisher is a mechanical grinding/polishing tool for micro-to-macro scale cross-sectioning. Visit Link with the details
X-Prep Milling Machine Description: The X-Prep is a mechanical milling/polishing system for micro/macro deconstruction (CNC) enabling analysis of interfaces, selective removal of discrete components and device thinning/removal. Visit Link with the details
	Exhibitor	Booth: 320
Chiplet Summit	Organizational	Booth: 419
Collateral from Chiplet Summit
SignatureIP Achieves PCI-SIG® PCIe® 5.0 Certification, Joining Elite Group on O Description: Next-Generation NoC Pioneer Demonstrates Industry-Leading PCIe Controller IP and Scalable IO Subsystems on Siemens Veloce proFPGA CS Platform Visit Link with the details
SigIP Unveils Industry-Leading CXL 3.2 Solution for High-Performance Computing Description: New CXL 3.2 IP and Flex Bus Port Technology Delivers Enhanced Performance for Next-Generation Data Center, AI, and HPC Applications Visit Link with the details
	Exhibitor	Booth: 417
Founded in 1984, Chroma is a world leading supplier in Automatic Testing Equipment (ATE), including electronic tests and measurement equipment and systems, for various ICT industries. Chroma also provides integrated and customized turnkey solutions through Test and Measurement instruments, Automatic Test Systems, and Manufacturing Execution Systems. Our multi-technological capabilities include solutions for: Automatic Optical Inspection, Photonics, Optical Communications, 3-D Sensing, LCD/LCM Test, AR/VR/MR Assembly and Test, Video Test, Semiconductor Parametric Test, Semiconductor / IC Test, Power Electronics, Passive Component, Electrical Safety, Automotive Electronics, and Thermal Control.
Collateral from Chroma ATE
King Cobra Extreme Description: King Cobra Extreme is a high-force, wide-temperature test system designed for demanding device validation. It supports DUT sizes from 5 × 5 mm up to 100 × 100 mm and delivers ≥294 kg contact force, with adjustable socketing force via pneumatic configura Visit Link with the details
Thermal - Temperature Forcing System Description: Cobra Thermal Systems deliver advanced temperature-forcing capabilities to meet the thermal demands of post-silicon validation and device characterization. Powered by the performance and reliability of direct phase change technology with fully integrate Visit Link with the details
King Cobra - Thermal System Description: The King Cobra model is designed for extreme cooling and high-power requirements, featuring cascade refrigeration technology to achieve extended temperature ranges of -70°C enabling junction temperatures (TJ) of -40°C or lower. This makes it well-suited Visit Link with the details
Sea Cobra - Temperature Forcing System Description: The SeaCobra model builds upon the same proven technology as the base Cobra, enhanced with a more powerful inverter-driven compressor and increased heater power to meet the demands of high-power applications exceeding 1kW. SeaCobra provides precise temp Visit Link with the details
	Exhibitor	Booth: 318
Claros leverages innovative hardware and software to enable higher compute density, optimizing power delivery, increasing compute performance, and maximizing the overall efficiency of data centers and their AI applications. For more information, please visit: https://claros.tech/
	Exhibitor	Booth: 222
We address fundamental problems in distributed systems using protocols, data structures and algorithms inspired by Quantum Information Theory. Our market is next generation platforms for secure, reliable, cutting edge, distributed computing. We provide 5G network slices with a fundamentally more secure graph confinement architecture. Initial use-cases include Digital Twins, Multiplayer Games and Web 3.0.
	Exhibitor	Booth: 217
EXTOLL develops its own semiconductor IP for high-performance data interfaces and network functionality and is a leading supplier of high-speed and ultra-low power SerDes and Chiplet connectivity. EXTOLL designs and develops semiconductor IP with smallest footprints and highest PPA, serving the worldwide market of ASIC, SoC- and Chiplet-Makers in various segments. The portfolio provides customers with tailored solutions for their systems covering NoC (Network-on-Chip) and Die-to-Die interfaces. EXTOLL delivers innovative solutions - SerDes, UCIe, NoC - to enable customers to successfully migrate into the Chiplet Age.
	Organizational	Booth: 323
The Fraunhofer Institute for Integrated Circuits IIS is a world leader in research on microelectronic and IT system solutions and services. Chiplet integration is revolutionizing the development of electronic systems, and we are at the forefront of this exciting trend. Our expertise spans system, component, and transistor levels, ensuring a comprehensive approach to your project. At the system level, we focus on innovative architectures that push boundaries. Meanwhile, we pay special attention to the critical interfaces between chiplets and power supplies at the component level, ensuring seamless performance and reliability.
	Exhibitor	Booth: 214
HeatSync is a thermal engineering consulting firm specializing in advanced thermal management. We help companies solve complex thermal and thermo-mechanical challenges across the entire technology stack — from silicon to system-level infrastructure. Our expertise includes architectural design, advanced simulation, digital twins, testing, training, and specialized engineering staffing.
	Organizational	Booth: 321
	Exhibitor	Booth: 322
InPsytech, Inc., also known as InPsy, is a silicon IP innovator, delivering industry leading, standards based connectivity solutions for high-speed die-to-die and chip-to-chip communications. Our production proven UCIe PHY, UCIe Controller, and ONFI PHY/IO IP enables seamless die to die connectivity with optimal bandwidth, power efficiency, and scalability. Headquartered in Zhubei, Taiwan, with team members based in San Jose, California, we work closely with foundries and design companies worldwide to accelerate time to market on cutting edge process nodes. With deep expertise in data movement across compute, memory, storage and I/O domains, InPsy empowers customers to confidently build next generation heterogeneous systems using the UCIe ecosystem.
	Exhibitor	Booth: 314
Mirabilis Design provides chiplet and UCIe system-level IP, modeling templates and architecture-trade-off platforms. The system-level IP contains timing, all the settings as parameters, power, thermal and protocol functionality. The modeling templates contains various AI, parallel processors, GPU, memory, analog and IO chiplet models that can be used to test, analyze, optimize and validate the system system. Mirabilis Design has over 80 customers in semiconductors, embedded systems and software. The company is based in Santa Clara, CA, USA and has development and support centers in India, Germany, South Korea, China and Japan.
	Exhibitor	Booth: 319
proteanTecs is the leading provider of deep data analytics for advanced electronics monitoring. Trusted by global leaders in the datacenter, automotive, communications and mobile markets, the company provides system health and performance monitoring, from production to the field. By applying machine learning to novel data created by on-chip monitors, the company's deep data analytics solutions deliver unparalleled visibility and actionable insights—leading to new levels of quality and reliability. Founded in 2017 and backed by world-leading investors, the company is headquartered in Israel and has offices in the United States, India and Taiwan. For more information, visit www.proteanTecs.com.
	Exhibitor	Booth: 310
Qualitas Semiconductor, a leading interconnect solution specialist in Korea, excels in high-speed interconnect technology. As a fabless company, we specialize in providing comprehensive high-speed interconnect solutions required for complex and massive data computations in various fields, including AI, automotive, data centers, AR/VR, mobile, and display.
	Exhibitor	Booth: 416
QuickLogic delivers reconfigurable silicon solutions including embedded FPGA IP, FPGA chiplets, and custom FPGAs. With over 30 years of industry experience as a U.S. public company and ISO 9001 certification, QuickLogic enables flexible ASIC and SoC architectures that can be tailored and updated to support new features and evolving specifications.
	Exhibitor	Booth: 212
Ramtera Design Automation develops LVR (Layout Verification Reporter), a next-generation physical verification tool for integrated circuit design. LVR delivers fast, accurate, and scalable verification across multiple technology nodes, supporting DRC, LVS, ERC, XOR, Density, and ECO with a modern, multithreaded architecture. To learn more, please visit ramtera.com/
	Exhibitor	Booth: 315
Sarcina Technology is a semiconductor packaging and testing turnkey provider based in Palo Alto, California, with a design and supply chain management office in Taipei. The company serves leading U.S. and European firms with package design, power/signal integrity analysis, and thermal simulation. Additionally, Sarcina offers wafer probing, final test hardware design, test program development, device/package qualification, and comprehensive turnkey services. Sarcina has earned its reputation by delivering innovative, dependable, and proven solutions to customers worldwide.
	Exhibitor	Sponsor
SemiWiki.com, an influential online forum and knowledge-sharing hub for semiconductor professionals. The site, launched in 2011, brings together engineers, designers, vendors, and industry experts to debate, learn, and publish––with over 300,000 registered members as of the latest figures .
	Exhibitor	Booth: 414
Shin-Etsu MicroSi is a driving force in both the semiconductor and microelectronics industries worldwide. By infusing science and chemistry with innovation and collaboration, we create leading-edge solutions that turn possibilities into realities–while providing the proven quality and time-tested dependability on which our customers rely. From computers to cell phones, 5G, automobiles, coatings, and more, our products are used by companies throughout the world to make the integrated circuits and semiconductor devices that power everyday living. In addition to our superior customer satisfaction, our dedication to research, discovery, quality, and dependability is unparalleled.
	Exhibitor	Booth: 415
We specialize in interconnect and interface solutions for advanced SoC and chiplet-based designs. Our portfolio includes coherent and non-coherent Network-on-Chip (NoC) IP, PCIe 6.x and CXL 3.x controller IPs, system integration components, and iNoCulator.ai, our NoC design and exploration platform. SignatureIP supports scalable, high-performance, and chiplet-aware architectures for FPGA and ASIC implementations, working closely with customers across compute, AI, and advanced packaging ecosystems. Website: https://www.signatureip.ai
	Organizational	Booth: 406
Silicon Catalyst is the only accelerator focused on the Global Semiconductor Industry including Chips, Chiplets, Materials, IP and Silicon fabrication-based Photonics, MEMS, Sensors, Life Science and Quantum. More than 1,500 startup companies worldwide have engaged with Silicon Catalyst, and the company has admitted over 150 exciting companies. With a world-class network of mentors to advise startups, Silicon Catalyst is helping new semiconductor companies address the challenges in moving from idea to realization. The accelerator supplies startups with access to design tools, silicon devices, networking, and a path to funding, banking and marketing acumen to successfully launch and grow their company’s novel technology.
	Exhibitor	Booth: 216
Silicon Creations is a self-funded, leading silicon IP provider with offices in the US and Poland, and sales representation worldwide. The company provides world-class silicon intellectual property (IP) for precision and general-purpose timing (PLLs), oscillators, low-power, high-performance multi-protocol and targeted SerDes and high-speed differential I/Os for diverse applications including smart phones, wearables, consumer devices, processors, network devices, automotive, IoT, and medical devices. Silicon Creations' IP is proven and/or in high-volume mass production in process technologies up to the most advanced available in the industry.
	Exhibitor	Booth: 215
At SmartDV, we believe there’s a better way to approach semiconductor intellectual property (IP) for integrated circuits. We’ve been focused exclusively on IP since 2007—so whether you’re sourcing standards-based design IP for your next SoC, ASIC, or FPGA, or seeking verification solutions (VIP) to put your chip design through its paces, you’ll find SmartDV’s IP straightforward to integrate. By combining proprietary SmartCompiler™ technology with the knowledge of hundreds of expert engineers, SmartDV can customize IP to meet your unique design objectives: quickly, economically, and reliably. Don’t allow other suppliers to force one-size-fits-all cores into your chip design. Get the IP you need, tailored to your specifications, with SmartDV: IP Your Way.
Collateral from SmartDV
SmartDV Product Directory Description: Our catalog of 500+ interface IP products and verification solutions (VIP) is an ideal place to start your design. Visit Link with the details
	Exhibitor	Booth: 218
Sofics is a foundry independent semiconductor IP provider that has supported 100+ companies worldwide with specialty on-chip ESD protection and unique I/O circuits. The IP designs are integrated into more than 5000 IC designs across many different applications. The Sofics technology is silicon proven on more than 50 different processes from leading foundries like TSMC, Samsung Foundry, GlobalFoundries and several others. Sofics on-chip ESD protections, Analog & Digital IO can enable higher performance, higher ESD robustness, reduce design time and costs.
Collateral from Sofics
ESD clamps for Chiplet interfaces Description: Optimized Low Parasitic Capacitance ESD Clamps for High-Bandwidth 2.5D/3D Chiplet Interfaces in Advanced FinFET Technology Visit Link with the details
Sofics IP validated on TSMC 2nm Description: Sofics Delivers Remarkable PPA Performance Near Physical Limits on TSMC 2nm Technology Visit Link with the details
YorChip and Sofics Expand UCIe PHY Across TSMC Nodes Description: Enabling low-cost, low-latency chiplet connectivity for Physical AI at the edge Visit Link with the details
https://sofics.com/press-releases/graphcore-selects-sofics-ip-for-their-16nm-ip Description: Graphcore Selected 16nm FinFet ESD Solutions from Sofics for its Transformative Artificial Intelligence Processor Visit Link with the details
Sofics releases its ESD technology on TSMC 3nm process Description: Breakthrough in area efficiency pushes advanced applications to the next level Visit Link with the details
Sofics Tapes Out Test Chip on TSMC 4nm Description: Sofics Tapes Out Test Chip on TSMC 4nm Process with Novel ESD IP and Low-Power 1.8V and 3.3V GPIO Solutions Visit Link with the details
Protecting die-2-die interfaces… Description: What are the right specs for chiplets? Visit Link with the details
	Organizational	Sponsor