Paper Title: Cloud Optimized Silicon Storage

Paper Abstract: As storage requirements and customer use-cases grow in the cloud data center environment, the infrastructure is facing new challenges. In this presentation, we highlight three critical challenges that most cloud infrastructure providers face. 1. Multi-tenant support requires different service-level agreements based on the level of storage service provided to the end customers. Such multi-tenant support is driven by multi-core/CPU and multi-TB storage / SSDs adding additional compute overhead to the cloud infrastructure. 2. The expansion of edge devices driven by moving the compute closer to data (Ex: IOT, autonomous driving, etc.) increases the vulnerability and exposes the data to multiple attack vectors, raising a data security challenge. 3. Applications that involve AI/ML inference / database access increase the storage traffic and add CPU overhead. Such applications need real-time response and hence, low latency to storage access. Modern cloud infrastructure demand solutions for these challenges. We’ll discuss why and show how those solutions are best implemented in state-of-the-art SSD controllers.

Paper Author: Pichai Balaji, Director, Marvell

Author Bio: Pichai (Pic) Balaji is Director of Product Marketing, Flash BU at Marvell. In this role, Pic is responsible for leading the product marketing initiatives for Marvell’s Bravera™ SC5 PCIe Gen 5.0 SSD controller product family for cloud, data center and enterprise flash storage applications. Prior to this, he managed Marvell’s PCIe Gen 4.0 SSD controller product lines for PC-OEM, client, industrial, data center and edge device applications. Pic joined Marvell from Seagate Technology where he was Senior Manager, Customer Programs for cloud storage and enterprise OEM solutions. Previous to this, Pic was Senior Manager, Marketing at LSI /Avago Technologies (later acquired by Broadcom) and held various roles of increasing responsibility at Seagate Technology, managing SSD and HDD products, and customer engagement. Pic holds a B.E. in Electronics Engineering from MN Regional Engineering College (now renamed National Institute of Technology) in Allahabad, India and two M.S. degrees, one from Tennessee Technological University and the other from Southern Methodist University.