Paper Title: UCIe: An Open Industry Standard for Chiplets

Paper Abstract: High-performance workloads demand on-package integration of heterogeneous processing units, on-package memory, and communication infrastructure to meet the demands of the emerging compute landscape. AI, ML, data analytics, 5G, automotive, and high-performance computing are driving these demands to meet the needs of cloud computing, intelligent edge, and client computing infrastructure. On-package interconnects are a critical component to deliver the power-efficient performance with the right feature set in this evolving landscape. Universal Chiplet Interconnect Express (UCIe), is an open industry standard with a fully specified stack that comprehends plug-and-play interoperability of chiplets on a package, and which is similar to the seamless interoperability on board with off-package interconnect standards such PCI Express, Universal Serial Bus (USB), and Compute Express Link (CXL). This presentation will explore (1) usages and key metrics associated with different technology choices in UCIe, (2) the different layers and software models associated with UCIe along with the compliance and interoperability mechanisms, and (3) how UCIe will evolve to incorporate additional usage models in the future.

Paper Author: Debendra Das Sharma, Intel Senior Fellow, Chief Architect of I/O Technology and Standards, Intel, Universal Chiplet Interconnect Express (UCIe)

Author Bio: Dr. Debendra Das Sharma is an Intel Senior Fellow, Chief Architect of I/O Technology and Standards. He is an expert in IO subsystem and interface architecture, delivering Intel-wide critical interconnect technologies in Peripheral Component Interconnect Express (PCIe), coherency, multichip package interconnect, SoC, and rack scale architecture. He is the Technical Task Force Co-chair of CXL™ Consortium and a board member of PCI-SIG. Debendra joined Intel in 2001 from HP. He has a Ph.D. in Computer Engineering from the University of Massachusetts, Amherst and a Bachelor of Technology (Hons) degree in Computer Science and Engineering from the Indian Institute of Technology, Kharagpur. He holds 99 U.S. patents. Debendra currently lives in Saratoga, Calif. with his wife and two sons. He enjoys reading and participating in various outdoor and volunteering activities with his family.