Paper Title: Will DRAM Go 3D?

Paper Abstract: Today there are at least four technologies vying to convert DRAM from a planar to a 3D manufacturing technology. This presentation will explain how these technologies work, why DRAM is expected to yield its market to one of them (and when that opportunity might arise), and what these technologies must do to succeed DRAM. It will also use the history of NAND flash's difficult 3D NAND transition to project how long such a change might take, and how the market is likely to respond to the transition.

Paper Author: Dave Eggleston, Principal/Owner, Intuitive Cognition Consulting

Author Bio: Dave Eggleston is the owner and Principal of Intuitive Cognition Consulting, and he provides strategy and business development services to leading NVM and Storage clients. Dave’s extensive background in Flash, MRAM, RRAM, and Storage is built on 30+ years of industry experience serving as VP of Embedded Memory at GLOBALFOUNDRIES, CEO of RRAM pioneer start-up Unity Semiconductor (acquired by Rambus), Director of Flash Systems Engineering at Micron, NVM Product Engineering manager at SanDisk, and NVM Engineer at AMD. Dave is frequently invited as a speaker at international conferences as an expert on emerging NVM technologies and their applications. He holds a BSEE degree from Duke University, a MSEE degree from Santa Clara University, and 25+ NVM related granted patents.