Tuesday, November 10th
2:35-4:05
Session A-3: Using 3D XPoint to Overcome Storage Roadblocks (New Memory Technologies Track)
Organizer: Milind Weiling, Sr VP Programs and Operations, EMD Group

Paper Title: Tiering Across Intel Optane and NAND Flash Media

Paper Abstract: Intel "Optane" media provides data centers with the new ability to increase endurance while simultaneously reducing costs and boosting performance. Highlighting the endurance value of Intel Optane media, this talk is organized into three parts: First, the mathematically precise theory about conditions under which a data center workload benefits from deploying both Intel "Optane" SSDs and Intel' 3D NAND SSDs to improve endurance and performance at reduced cost; second, three proof points with empirical data showing how our theory applies to popular data center workloads; third, a generic tiering algorithm that maximizes the endurance and performance at optimal cost for data center workloads.

Paper Author: Kapil Karkra, Software Architect, Intel

Author Bio: Kapil is a Principal Engineer in the memory group (NSG) at Intel responsible for the software architecture of Virtual RAID on CPU (VROC), Volume Management Device (VMD), NVMe, and Caching Acceleration Software (CAS) drivers. He also leads host software pathfinding and advanced development activities. Kapil drove the latest proposal for enclosure management (NPEM) in the PCIe base specification for the NVMe ecosystem. His current focus is around improving storage TCO and performance through software approaches that use mixed media (e.g., Intel 3D Xpoint and Intel 3D NAND). Kapil has spent his entire 20 years career advancing storage architectures at companies like IBM, Philips, and Intel with over 15 issued patents. Kapil holds a bachelor’s degree in Electrical Engineering and a master’s degree in Business Administration.