Paper Title: NVMe Gen-4 Thermal Management: Too Hot To Touch

Paper Abstract: As drives get faster with the arrival of PCIe Gen-4, heat management moves down from Data Center to Client and Mobile platforms. Despite efficient designs using cutting edge process nodes, most of the heat is still generated by data movement over the channel from NAND. Next generation PCIe Gen-4 NVMe SSD will need effective cooling solutions. We will show power distribution between PMIC, NAND and ASIC. Additional results will cover thermal measurements for different workloads along with IR imaging. Finally we will provide guidance on on airflow and heatsink properties.

Paper Author: Grace Chen, Project Manager, Phison Electronics

Author Bio: Grace Chen is a Project Manager at Phison Electronics Corp in Hsinchu, Taiwan, where she works on consumer and enterprise SSD product lines. She has lead Ultrabook and Hyperscale SSD projects. Currently she is focused on bringing the first Gen-4 SSD to market. Before joining Phison in 2009, Grace worked as a research engineer at a semiconductor foundry in Taiwan. Grace holds a M. Eng degree from the University of Western Ontario and a BS in Electrical Engineering from Queen’s University, Canada.