Paper Title: BGA SSDs Lead the Way in Embedded Applications

Paper Abstract: New embedded applications, such as 5G mobile and automotive, require high-bandwidth storage in a small form factor. BGA SSDs are the best choice today since they meet those requirements as well as offering vibration-proof operation and the PCIe standard interface (allowing for use of the NVMe storage standard). The latest versions also have features such as SR-IOV (for IO virtualization), optimized thermal dissipation, and protection against host DRAM failures. With the widespread availability of 3D and TLC technologies, BGA SSDs provide extremely high performance and large amounts of storage (up to 1 TB) in a package one-fifth the size of the M.2 alternative.

Paper Author: Chris Lien, Senior Manager, ATP Electronics

Author Bio: Chris Lien is Sr Manager at ATP Electronics, where he leads product planning for eMMC and UFS-based devices in automotive and industrial applications. He focuses on long-term product strategy, team build-up, and new business engagement. He has over 15 years experience in the memory industry including the development of competitive flash products at Transcend Information Technology. He earned an MSEE from the University of Pittsburgh.