Paper Title: Achieving Higher-Density Code Storage with Flash Memory

Paper Abstract: Serial NOR flash is currently the standard way to store system code in a wide variety of applications. However, the technology becomes very expensive at process sizes below 5 nm. So a new solution is needed for applications requiring more than 512 Mb density. The answer is Serial SLC NAND flash based on the SPI interface. It offers a lower cost per bit while maintaining major compatibility with serial NOR for easy migration. Furthermore, a new manufacturing capability is now available in which serial NOR and serial NAND dies are stacked together in a single package. Security features can also be built into the serial flash.

Paper Author: K C Shekar, Sr Director Strategic Marketing, Winbond Electronics

Author Bio: K.C. Shekar is Sr Director Strategic Marketing at Winbond Electronics, where he has been responsible for introducing several new flash memory products and has helped grow the serial flash business to over $400M. An accomplished marketing executive, he has been actively involved in the flash memory market for 25 years, including leading the US NOR flash marketing team at Macronix. He participates in the JEDEC standards committee and is a co-patent holder on the important RPMC flash for security enhancement, which is expected to play a major role in future PC code storage. He earned an MSEE at Kansas State University and a Bachelor’s in Engineering at Bangalore University (India). His contributions have appeared in industry-leading magazines, including EE Times, EDN, and ECN, and he has presented at many events, including past Flash Memory Summits.