Paper Title: New Technologies and New Standards Enable New Mobile Applications

Paper Abstract: New mobile embedded standards such as UFS3.0 and PCI for Mobile provide higher data throughput with faster PHY interfaces. At the same time, 3D NAND provides larger storage capacities in the same space. The combination helps meet user requirements such as the need for constant connection and the ability to handle 4K or 8K video content. It provides state-of-the-art architecture realization, the innovation of power optimization, and reliable data error handling which will enable many new applications for embedded storage.

Paper Author: Robert Hsieh, Product Marketing Director, Silicon Motion

Author Bio: Robert Hsieh leads mobile embedded product marketing at Silicon Motion, where he does strategic product planning and OEM project management for mobile embedded products. He has managed to mass production eMMC/UFS controllers for the company and has successfully designed in key OEM customers. He has more than 15 years experience in storage product design and mobile product marketing. He is a USFA Board Member and has presented at past Flash Memory Summits.