| Agarwal, Ravi | Meta | B-202: How to Make Chiplets a Viable Market (Panel) | Thursday | 02:00 |
| Allan, Gordon | Siemens EDA | A-103: Design - 1 | Wednesday | 04:30 |
| Allan, Gordon | Siemens EDA | Pre-Conference Tutorial A: Chiplet Basics | Tuesday | 08:30 |
| Alon, Elad | Blue Cheetah Analog Design | C-102: Best Way to Optimize Chiplets Panel (sponsored by Canonical) | Wednesday | 03:15 |
| Alon, Elad | Blue Cheetah Analog Design | Pre-Conference Tutorial H: The New Open Chiplet Economy | Tuesday | 01:00 |
| Armbrust, Daniel | Silicon Catalyst | Keynote 3: Silicon Catalyst | Wednesday | 11:30 |
| Baktha, Balaji | Ventana Micro Systems | Special Presentation 2: RISC-V International | Wednesday | 11:20 |
| Balachandran, Jayaprakash | Cisco Systems | Pre-Conference Tutorial H: The New Open Chiplet Economy | Tuesday | 01:00 |
| Basoco, Nitza | proteanTecs | Keynote 2: proteanTecs | Wednesday | 10:50 |
| Berar, Andrei | Amkor Technologies | Pre-Conference Tutorial G: Test and Integration | Tuesday | 01:00 |
| Best, Scott | Rambus | Pre-Conference Tutorial H: The New Open Chiplet Economy | Tuesday | 01:00 |
| Best, Scott | Rambus | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Beyne, Eric | imec | A-202: Packaging - 2 | Thursday | 02:00 |
| Bishop, Craig | Deca Technologies | Pre-Conference Tutorial C: Advanced Packaging Methods | Tuesday | 08:30 |
| Bishop, Craig | Deca Technologies | C-103: Next Great Breakthrough in Chiplets Panel | Wednesday | 04:30 |
| Borrill, Paul | Daedaelus | C-202: Highlights from University Research on Chiplets | Thursday | 02:00 |
| Borrill, Paul | Daedaelus | Pre-Conference Tutorial D: Interfaces | Tuesday | 08:30 |
| Bozman, Jean | Cloud Architects Advisors | C-101: Overcoming Chiplet Design Challenges - How Industry Can Help (Panel) | Wednesday | 02:00 |
| Brennan, Bob | Intel | Keynote 4: Intel | Thursday | 10:10 |
| Brookwood, Nathan | Insight 64 | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Brookwood, Nathan | Insight 64 | B-103: Integration - 2 | Wednesday | 04:30 |
| Cao, Lihong | ASE Group | Pre-Conference Tutorial C: Advanced Packaging Methods | Tuesday | 08:30 |
| Cao, Lihong | ASE Group | Pre-Conference Tutorial C: Advanced Packaging Methods | Tuesday | 08:30 |
| Carlson, Mark | SNIA | Special Presentation 4: SNIA | Thursday | 11:20 |
| Chang, Ken | Cadence | C-102: Best Way to Optimize Chiplets Panel (sponsored by Canonical) | Wednesday | 03:15 |
| Choy, Junho | Siemens EDA | A-202: Packaging - 2 | Thursday | 02:00 |
| Choy, Junho | Siemens EDA | A-101: Packaging - 1 | Wednesday | 02:00 |
| Chugh, Rishi | Cadence | C-101: Overcoming Chiplet Design Challenges - How Industry Can Help (Panel) | Wednesday | 02:00 |
| Coughlin, Tom | Coughlin Associates | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Cron, Adam | Synopsys | Pre-Conference Tutorial C: Advanced Packaging Methods | Tuesday | 08:30 |
| Cron, Adam | Synopsys | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Cron, Adam | Synopsys | Pre-Conference Tutorial G: Test and Integration | Tuesday | 01:00 |
| De Schutter, Tom | Synopsys | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Dutoit, Denis | CEA-List | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Dutoit, Denis | CEA-List | B-102: Test | Wednesday | 03:15 |
| Evans, Jonathon | NVIDIA | C-102: Best Way to Optimize Chiplets Panel (sponsored by Canonical) | Wednesday | 03:15 |
| Farjadrad, Ramin | Eliyan | Pre-Conference Tutorial D: Interfaces | Tuesday | 08:30 |
| Farjadrad, Ramin | Eliyan | Pre-Conference Tutorial D: Interfaces | Tuesday | 08:30 |
| Farjadrad, Ramin | Eliyan | C-102: Best Way to Optimize Chiplets Panel (sponsored by Canonical) | Wednesday | 03:15 |
| Ferguson, John | Siemens EDA | Superpanel: Successful Co-Package Design in a Post-Moore Era | Tuesday | 05:00 |
| Finnegan, Jim | Netronome | Keynote 5: Corigine | Thursday | 10:50 |
| Franzon, Paul | North Carolina State University | Superpanel: Successful Co-Package Design in a Post-Moore Era | Tuesday | 05:00 |
| Franzon, Paul | North Carolina State University | Pre-Conference Tutorial A: Chiplet Basics | Tuesday | 08:30 |
| Franzon, Paul | North Carolina State University | B-201: Partitioning (Disaggregation) | Thursday | 09:00 |
| Freeman, Dean | 3DInCites | Special Presentation 3: 3DInCites | Thursday | 10:40 |
| Freeman, Dean | FTMA | C-103: Next Great Breakthrough in Chiplets Panel | Wednesday | 04:30 |
| Gervasi, Bill | Nantero | Pre-Conference Tutorial E: Design Methods | Tuesday | 01:00 |
| Giuliano, Letizia | Alphawave SEMI | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Giuliano, Letizia | Alphawave SEMI | Pre-Conference Tutorial D: Interfaces | Tuesday | 08:30 |
| Grossner, Cliff | Open Compute Project | Pre-Conference Tutorial H: The New Open Chiplet Economy | Tuesday | 01:00 |
| Grossner, Cliff | Open Compute Project | Keynote 6: Open Compute Project | Thursday | 11:30 |
| Gupta, Puneet | UCLA | C-202: Highlights from University Research on Chiplets | Thursday | 02:00 |
| Hackenberg, Tom | Yole Intelligence | Pre-Conference Tutorial H: The New Open Chiplet Economy | Tuesday | 01:00 |
| Hackenberg, Tom | Yole Development | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Hackenberg, Tom | Yole Intelligence | B-203: Chiplets in 2028 and How We Got There (Panel) | Thursday | 03:30 |
| Hassen, Omar | Ventana Micro Systems | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Hassen, Omar | Ventana Micro Systems | B-203: Chiplets in 2028 and How We Got There (Panel) | Thursday | 03:30 |
| Heinig, Andy | Fraunhofer IIS | A-102: Applications | Wednesday | 03:15 |
| Heinig, Andy | Fraunhofer IIS | D-101: Annual Update on Packaging | Wednesday | 02:00 |
| Hsu, Jen-Tai | Global Unichip | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Huffman, Amber | Google | Pre-Conference Tutorial H: The New Open Chiplet Economy | Tuesday | 01:00 |
| Hutchins, Jeff | Ranovus | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Hutner, Marc | proteanTecs | A-201: Interfaces | Thursday | 09:00 |
| Hutner, Marc | proteanTecs | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Ilyadis, Nick | Achronix | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Ilyadis, Nick | Achronix | Pre-Conference Tutorial G: Test and Integration | Tuesday | 01:00 |
| Islam, Nokibul | JCET Group | A-102: Applications | Wednesday | 03:15 |
| Islam, Nokibul | JCET Group | C-201: Best Packaging for Chiplets Today Panel (sponsored by ASE) | Thursday | 09:00 |
| Jani, Dharmesh | Meta | Pre-Conference Tutorial H: The New Open Chiplet Economy | Tuesday | 01:00 |
| Johal, Kash | eTopus Technology | Pre-Conference Tutorial H: The New Open Chiplet Economy | Tuesday | 01:00 |
| Johal, Kash | eTopus Technology | B-101: Integration - 1 (sponsored by EMD Electronics) | Wednesday | 02:00 |
| Kapoor, Shekhar | Synopsys | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Kapoor, Shekhar | Synopsys | D-102: Annual Update on Chiplet Design: Multi-Die System in the post Moore Era | Wednesday | 03:15 |
| Kelly, Mike | Amkor Technology | C-201: Best Packaging for Chiplets Today Panel (sponsored by ASE) | Thursday | 09:00 |
| Kengeri, Subi | Applied Materials | Keynote 1: Applied Materials | Wednesday | 10:10 |
| Kotowski, Steve | Ayar Labs | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Kruckemyer, David | Ventana Micro Systems | Pre-Conference Tutorial E: Design Methods | Tuesday | 01:00 |
| Kuemerle, Mark | Marvell Semiconductor | B-202: How to Make Chiplets a Viable Market (Panel) | Thursday | 02:00 |
| Kuemerle, Mark | Marvell Semiconductor | C-101: Overcoming Chiplet Design Challenges - How Industry Can Help (Panel) | Wednesday | 02:00 |
| Lalgudi, Subramanian (Lal) | Siemens EDA | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Lambalot, Daniel | Alphawave IP Group | C-201: Best Packaging for Chiplets Today Panel (sponsored by ASE) | Thursday | 09:00 |
| Lanier, Travis | Ventana Micro Systems | B-202: How to Make Chiplets a Viable Market (Panel) | Thursday | 02:00 |
| Larsen, Kenneth | Synopsys | C-102: Best Way to Optimize Chiplets Panel (sponsored by Canonical) | Wednesday | 03:15 |
| Larsen, Kenneth | Synopsys | Pre-Conference Tutorial E: Design Methods | Tuesday | 01:00 |
| Leon, Sonia | Intel | Pre-Conference Tutorial F: Power and Thermal | Tuesday | 01:00 |
| Li, Michael | Corigine | Pre-Conference Tutorial E: Design Methods | Tuesday | 01:00 |
| Li, Mike | Corigine | C-103: Next Great Breakthrough in Chiplets Panel | Wednesday | 04:30 |
| Macian Ruiz, Carlos | Marvell | Pre-Conference Tutorial E: Design Methods | Tuesday | 01:00 |
| Macian Ruiz, Carlos | Marvell | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Massoudi, Firooz | Synopsys | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Mastroianni, Tony | Siemens Digital Industry Software | Pre-Conference Tutorial E: Design Methods | Tuesday | 01:00 |
| Mastroianni, Tony | Siemens Digital Industry Software | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Mastroianni_Intro, Tony | Siemens Digital Industry Software | Pre-Conference Tutorial E: Design Methods | Tuesday | 01:00 |
| McIntyre, David | Samsung Semiconductor | D-101: Annual Update on Packaging | Wednesday | 02:00 |
| Mirkarimi, Laura | Adeia | Pre-Conference Tutorial G: Test and Integration | Tuesday | 01:00 |
| Mirkarimi, Laura | Adeia | C-201: Best Packaging for Chiplets Today Panel (sponsored by ASE) | Thursday | 09:00 |
| Mirkarimi, Laura | Xperi | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Mittal, Millind | AMD | B-203: Chiplets in 2028 and How We Got There (Panel) | Thursday | 03:30 |
| Mittal, Rohit | Google | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Modirzadeh, Soheil | Synopsys | D-201: Annual Update on Test of Multi-Die Designs | Thursday | 09:00 |
| Modirzadeh, Soheil | Synopsys | D-102: Annual Update on Chiplet Design: Multi-Die System in the post Moore Era | Wednesday | 03:15 |
| Munsey, Michael | Siemens EDA | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Murthy, Anu | FADU | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Murthy, Anu | FADU | Pre-Conference Tutorial D: Interfaces | Tuesday | 08:30 |
| Murthy, Anu | FADU | D-103: Annual Update on Interfaces | Wednesday | 04:30 |
| Murthy, Anu | FADU | Pre-Conference Tutorial D: Interfaces | Tuesday | 08:30 |
| Nasrullah, Jawad | Palo Alto Electron | B-203: Chiplets in 2028 and How We Got There (Panel) | Thursday | 03:30 |
| Ogras, Umit | University of Wisconsin | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Otte, Dick | Promex Industries | C-201: Best Packaging for Chiplets Today Panel (sponsored by ASE) | Thursday | 09:00 |
| Ouelette, Matthew | AMD | B-203: Chiplets in 2028 and How We Got There (Panel) | Thursday | 03:30 |
| Ouellette, Matthew | AMD | Pre-Conference Tutorial A: Chiplet Basics | Tuesday | 08:30 |
| Pan, Marcus | Semiconductor Research Corporation (SRC) | Superpanel: Successful Co-Package Design in a Post-Moore Era | Tuesday | 05:00 |
| Pantano, Nicolas | imec | A-202: Packaging - 2 | Thursday | 02:00 |
| Pasdast, Gerald | UCIe™ Consortium | Pre-Conference Tutorial D: Interfaces | Tuesday | 08:30 |
| Pasdast, Gerald | UCIe™ Consortium | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Pasdast, Gerald | UCIe™ Consortium | Pre-Conference Tutorial D: Interfaces | Tuesday | 08:30 |
| Patel, Ash | Synopsys | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Patti, Bob | nHanced Semiconductors | Superpanel: Successful Co-Package Design in a Post-Moore Era | Tuesday | 05:00 |
| Patti, Robert | nHanced Semiconductors | Pre-Conference Tutorial F: Power and Thermal | Tuesday | 01:00 |
| Patti, Robert | nHanced Semiconductors | C-103: Next Great Breakthrough in Chiplets Panel | Wednesday | 04:30 |
| Pendurkar, Rajesh | Capgemini | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Posner, Mick | Synopsys | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Ratchkov, David | Anemoi Software | Pre-Conference Tutorial A: Chiplet Basics | Tuesday | 08:30 |
| Ratchkov, David | Anemoi Software | Pre-Conference Tutorial F: Power and Thermal | Tuesday | 01:00 |
| Rea, Brian | UCIe™ Consortium | Special Presentation 1: UCIe Consortium | Wednesday | 10:40 |
| Rea, Brian | UCIe™ Consortium | Special Presentation 1: UCIe Consortium | Wednesday | 10:40 |
| Rodriguez, Luis E. | Avery Design Systems | C-101: Overcoming Chiplet Design Challenges - How Industry Can Help (Panel) | Wednesday | 02:00 |
| Salama, Sam | Hyperion | Pre-Conference Tutorial C: Advanced Packaging Methods | Tuesday | 08:30 |
| Sandstrom, Cliff | Deca Technologies | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Sever, Nir | proteanTecs | C-101: Overcoming Chiplet Design Challenges - How Industry Can Help (Panel) | Wednesday | 02:00 |
| Shaizaf, Erez | Alchip | C-103: Next Great Breakthrough in Chiplets Panel | Wednesday | 04:30 |
| Shalf, John | Lawrence Berkeley National Laboratory | Pre-Conference Tutorial H: The New Open Chiplet Economy | Tuesday | 01:00 |
| Shalf, John | Lawrence Berkeley National Laboratory | B-203: Chiplets in 2028 and How We Got There (Panel) | Thursday | 03:30 |
| Shalf, John | Lawrence Berkeley National Laboratory | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Shei, Mike | Corigine | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Sheth, Sid | d-Matrix | Pre-Conference Tutorial H: The New Open Chiplet Economy | Tuesday | 01:00 |
| Sobey, Chuck | SmartNICs Summit | Chiplets: Where We Are Today | Wednesday | 09:00 |
| Sobey, Chuck | SmartNICs Summit | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Sobey, Chuck | SmartNICs Summit | Introduction to Chiplet Summit | Wednesday | 08:45 |
| Soheili, Patrick | Eliyan | C-101: Overcoming Chiplet Design Challenges - How Industry Can Help (Panel) | Wednesday | 02:00 |
| Srivastava, Durgesh | NVIDIA | B-202: How to Make Chiplets a Viable Market (Panel) | Thursday | 02:00 |
| Swan, Laura | Silicon Catalyst Angels | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Van der Plas, Geert | imec | A-202: Packaging - 2 | Thursday | 02:00 |
| Vardaman, Jan | TechSearch International | Superpanel: Successful Co-Package Design in a Post-Moore Era | Tuesday | 05:00 |
| Vass-Varnai, Andras | Siemens EDA | Pre-Conference Tutorial F: Power and Thermal | Tuesday | 01:00 |
| Vass-Varnai, Andras | Siemens EDA | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Viklund, Per | Siemens EDA | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Vinnakota, Bapi | Open Compute Project | Keynote 6: Open Compute Project | Thursday | 11:30 |
| Vinnakota, Bapi | Open Compute Project | Pre-Conference Tutorial H: The New Open Chiplet Economy | Tuesday | 01:00 |
| Vinnakota, Bapi | Open Compute Project | Pre-Conference Tutorial H: The New Open Chiplet Economy | Tuesday | 01:00 |
| Vinnakota, Bapi | Broadcom | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Vinnakota, Bapi | Open Compute Project | B-203: Chiplets in 2028 and How We Got There (Panel) | Thursday | 03:30 |
| Vivet, Pascal | CEA-List | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Vivet, Pascal | CEA-List | Pre-Conference Tutorial F: Power and Thermal | Tuesday | 01:00 |
| Walia, Manmeet | Synopsys | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Walker, Clint | Alphawave SEMI | B-202: How to Make Chiplets a Viable Market (Panel) | Thursday | 02:00 |
| Wang, Mao | QuickLogic | B-101: Integration - 1 (sponsored by EMD Electronics) | Wednesday | 02:00 |
| Watanabe, Atom | IBM | C-102: Best Way to Optimize Chiplets Panel (sponsored by Canonical) | Wednesday | 03:15 |
| Weling, Milind | EMD Electronics | B-101: Integration - 1 (sponsored by EMD Electronics) | Wednesday | 02:00 |
| Wilkerson, Brett | AMD | Superpanel: Successful Co-Package Design in a Post-Moore Era | Tuesday | 05:00 |
| Wong, James | Palo Alto Electron | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Wong, James | Palo Alto Electron | Pre-Conference Tutorial H: The New Open Chiplet Economy | Tuesday | 01:00 |
| Wong, James | Palo Alto Electron | A-203: Design - 2 | Thursday | 03:30 |
| Wooden, Tim | Smiths Interconnect | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Yee, Kevin | Samsung Semiconductor | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Yee, Kevin | Samsung Semiconductor | B-202: How to Make Chiplets a Viable Market (Panel) | Thursday | 02:00 |
| Ziai, Syrus | Eliyan | C-201: Best Packaging for Chiplets Today Panel (sponsored by ASE) | Thursday | 09:00 |
| Zorian, Yervant | Synopsys Inc | Pre-Conference Tutorial A: Chiplet Basics | Tuesday | 08:30 |
| Zorian, Yervant | Synopsys Inc | Chat with the Experts (sponsored by Achronix) | Tuesday | 06:00 |
| Zu, Larry | Sarcina Technology | Pre-Conference Tutorial C: Advanced Packaging Methods | Tuesday | 08:30 |
| Zu, Larry | Sarcina Technology | A-202: Packaging - 2 | Thursday | 02:00 |