SpeakerAffiliationSessionDayStart Time
Agarwal, RaviMetaC-201: Making Chiplets a Viable Market (sponsored by SmartSoC Solutions)Thursday9:00
Alon, EladBlue Cheetah Analog DesignPre-Conference Tutorial D: Interfaces (Section 1)Tuesday8:30 AM
Alon, EladBlue Cheetah Analog DesignTutorial H Panel: Making the Open Chiplet Economy GrowTuesday1:00
Alon, EladBlue Cheetah Analog DesignC-103: Best Way to Optimize Chiplets (Panel)Wednesday4:30
Alon, EladBlue Cheetah Analog DesignTutorial D Panel: Choosing the Right Die-to-Die Interface for Your ApplicationTuesday8:30
An, JinhoApplied MaterialsC-101: Chiplets Drive Top Leading-Edge DesignsWednesday2:00
Ardalan, ShahabEnosemiC-103: Best Way to Optimize Chiplets (Panel)Wednesday4:30
Basoco, NitzaTeradyneC-102: Next Great Breakthrough in Chiplets (Panel)Wednesday3:15
Berry, MarkCOT-NPI GroupB-201: Integration - 1Thursday9:00
Best, ScottRambusC-202: Chiplets for Entrepreneurs - Making Money in the Chiplet GameThursday2:00
Bishop, CraigDeca TechnologiesPre-Conference Tutorial C: Advanced Packaging MethodsTuesday8:30 AM
Borrill, PaulDaedaelusSuperpanel: How Can Chiplets Accelerate Generative AI Applications?Tuesday5:00
Borrill, PaulDaedaelusB-102: Applications - 1Wednesday3:15
Bozman, JeanCloud ArchitectsC-102: Next Great Breakthrough in Chiplets (Panel)Wednesday3:15
Bozman, JeanCloud ArchitectsC-103: Best Way to Optimize Chiplets (Panel)Wednesday4:30
Bozman, JeanCloud ArchitectsPre-Conference Tutorial F: Working with FoundriesTuesday1:00
Brookwood, NathanInsight 64D-101: Annual Update on PackagingWednesday2:00
Brookwood, NathanInsight 64D-102: Annual Update on Die-to-Die InterfacesWednesday3:15
Cameron, KevinCameron EDAPre-Conference Tutorial G: AI in Chiplet DesignTuesday1:00
Chan Carusone, TonyAlphawave SemiKeynote 4: Alphawave SemiThursday10:10
Chang, NormanAnsysPre-Conference Tutorial G: AI in Chiplet DesignTuesday1:00
Chen, KevinLam ResearchSuperpanel: How Can Chiplets Accelerate Generative AI Applications?Tuesday5:00
Cone, ChrisSiemens EDAPre-Conference Tutorial C: Advanced Packaging MethodsTuesday8:30 AM
DeLaCruz, JavierArmD-103: Annual Update on Chiplet Design - Key Challenges and How to Meet ThemWednesday4:30
Donnelly, KevinEliyanTutorial D Panel: Choosing the Right Die-to-Die Interface for Your ApplicationTuesday8:30
Dutoit, DenisCEA-ListA-201: Design - 3Thursday9:00
Dutoit, DenisCEA-ListC-101: Chiplets Drive Top Leading-Edge DesignsWednesday2:00
Dutoit, DenisCEA-ListA-103: Design - 2Wednesday4:30
Elkanovich, IgorGlobal Unichip (GUC)B-201: Integration - 1Thursday9:00
Fahey, PaulSK hynixSuperpanel: How Can Chiplets Accelerate Generative AI Applications?Tuesday5:00
Faith, BrianQuickLogicC-202: Chiplets for Entrepreneurs - Making Money in the Chiplet GameThursday2:00
Farjad, RaminEliyanB-103: Interfaces - 2Wednesday4:30
Farjad, RaminEliyanC-201: Making Chiplets a Viable Market (sponsored by SmartSoC Solutions)Thursday9:00
Felton, KeithSiemens EDAPre-Conference Tutorial G: AI in Chiplet DesignTuesday1:00
Ferguson, JohnSiemens EDAPre-Conference Tutorial F: Working with FoundriesTuesday1:00
Ferguson, JohnSiemens EDAA-103: Design - 2Wednesday4:30
Ferguson, JohnSiemens EDAA-101: Security - 1Wednesday2:00
Finnegan, JimNetronomeC-102: Next Great Breakthrough in Chiplets (Panel)Wednesday3:15
Franzon, PaulNorth Carolina State UniversityB-202: Best Packaging for Chiplets Today (Panel)Thursday2:00
Fulton, PamIntelPre-Conference Tutorial F: Working with FoundriesTuesday1:00
Giuliano, LetiziaAlphawave SemiD-103: Annual Update on Chiplet Design - Key Challenges and How to Meet ThemWednesday4:30
Giuliano, LetiziaAlphawave SemiTutorial H Panel: Making the Open Chiplet Economy GrowTuesday1:00
Giuliano, LetiziaAlphawave SemiPre-Conference Tutorial H: The New Open Chiplet EconomyTuesday1:00
Giuliano, LetiziaAlphawave SemiTutorial D Panel: Choosing the Right Die-to-Die Interface for Your ApplicationTuesday8:30
Giuliano, LetiziaAlphawave SemiD-102: Annual Update on Die-to-Die InterfacesWednesday3:15
Grossner, CliffOpen Compute Project (OCP)Keynote 6: Open Compute ProjectThursday11:35
Grossner, CliffOpen Compute Project (OCP)Pre-Conference Tutorial H: The New Open Chiplet EconomyTuesday1:00
Hackenberg, TomYole GroupB-203: Chiplets in 2029 and How We Got There (Panel)Thursday3:30
Hackenberg, TomYole GroupTutorial H Panel: Making the Open Chiplet Economy GrowTuesday1:00
Harrison, LeeSiemens Digital Industries SoftwareA-101: Security - 1Wednesday2:00
Heinig, AndyFraunhofer IISPre-Conference Tutorial H: The New Open Chiplet EconomyTuesday1:00
Heinig, AndyFraunhofer IISPre-Conference Tutorial D: Interfaces (Section 1)Tuesday8:30 AM
Hossam, NermeenSiemens EDAA-103: Design - 2Wednesday4:30
Hutchins, JeffRanovusB-103: Interfaces - 2Wednesday4:30
Ilyadis, NickAchronixPre-Conference Tutorial D: Interfaces (Section 1)Tuesday8:30 AM
Ilyadis, NickAchronixSuperpanel: How Can Chiplets Accelerate Generative AI Applications?Tuesday5:00
Ilyadis, NickAchronixB-103: Interfaces - 2Wednesday4:30
Ilyadis, NickAchronixB-101: Interfaces - 1Wednesday2:00
Islam, NokibulJCET GroupB-202: Best Packaging for Chiplets Today (Panel)Thursday2:00
Islam, NokibulJCET GroupB-102: Applications - 1Wednesday3:15
Islam, NokibulJCET GroupPre-Conference Tutorial C: Advanced Packaging MethodsTuesday8:30 AM
Jani, DharmeshMetaB-101: Interfaces - 1Wednesday2:00
Jani, DharmeshMetaTutorial H Panel: Making the Open Chiplet Economy GrowTuesday1:00
Johal, KashYorChipA-103: Design - 2Wednesday4:30
Joly, SylvieCEA-ListB-201: Integration - 1Thursday9:00
Kamal, PratyushSiemens EDAA-202: Design - 4Thursday2:00
Kareenahalli, SuryaIntelPre-Conference Tutorial A: Chiplet BasicsTuesday8:30 AM
Keding, HolgerSynopsysPre-Conference Tutorial E: Design MethodsTuesday1:00
Kelly, MikeAmkorD-101: Annual Update on PackagingWednesday2:00
Kengeri, SubiApplied MaterialsKeynote 1: Applied MaterialsWednesday10:10
Kepler, NickSilicon CatalystSpecial Presentation 2: Silicon CatalystWednesday11:20
Keppens, BartSoficsA-202: Design - 4Thursday2:00
Knight, MarkArmSpecial Presentation 4: ArmThursday11:20
Knight, MarkArmC-102: Next Great Breakthrough in Chiplets (Panel)Wednesday3:15
Kohli, VinceImpact VCC-202: Chiplets for Entrepreneurs - Making Money in the Chiplet GameThursday2:00
Kultran, DanEpirusA-103: Design - 2Wednesday4:30
Kumar, ArunSynopsysPre-Conference Tutorial A: Chiplet BasicsTuesday8:30 AM
Kumar, ArvindIBMC-101: Chiplets Drive Top Leading-Edge DesignsWednesday2:00
Lalgudi, SubramanianSiemens EDAA-201: Design - 3Thursday9:00
Lalgudi, SubramanianSiemens EDAA-102: Design - 1Wednesday3:15
Lambalot, DanielAlphawave SemiB-202: Best Packaging for Chiplets Today (Panel)Thursday2:00
Land, IanSynopsys IndiaB-102: Applications - 1Wednesday3:15
Larsen, KennethSynopsysPre-Conference Tutorial F: Working with FoundriesTuesday1:00
Larsen, KennethSynopsysC-101: Chiplets Drive Top Leading-Edge DesignsWednesday2:00
Lee, Hee-SooKeysight TechnologiesB-101: Interfaces - 1Wednesday2:00
Leong, AmySkywater TechnologyPre-Conference Tutorial A: Chiplet BasicsTuesday8:30 AM
Lewer, PhilipUntether AIB-102: Applications - 1Wednesday3:15
Lewer, PhilipUntether AIC-103: Best Way to Optimize Chiplets (Panel)Wednesday4:30
Lin, LangAnsysA-102: Design - 1Wednesday3:15
Lujan, AmySavansys SolutionsPre-Conference Tutorial C: Advanced Packaging MethodsTuesday8:30 AM
McIntyre, DavidSNIA Board of DirectorsSpecial Presentation 3: SNIAThursday10:40
McIntyre, DavidSamsung SemiconductorTutorial D Panel: Choosing the Right Die-to-Die Interface for Your ApplicationTuesday8:30
McIntyre, DavidSamsung SemiconductorPre-Conference Tutorial D: InterfacesTuesday08:30 AM
Mehta, ManishBroadcomPre-Conference Tutorial D: Interfaces (Section 1)Tuesday8:30 AM
Merlo, PedroKeysight TechnologiesD-103: Annual Update on Chiplet Design - Key Challenges and How to Meet ThemWednesday4:30
Mirkarimi, LauraAdeiaB-202: Best Packaging for Chiplets Today (Panel)Thursday2:00
Mittal, RohitGoogleSuperpanel: How Can Chiplets Accelerate Generative AI Applications?Tuesday5:00
Modirzadeh, SoheilSynopsysKeynote 2: SynopsysWednesday10:50
Mota, ManuelSynopsysB-101: Interfaces - 1Wednesday2:00
Naeimi, HeliaTenstorrentC-101: Chiplets Drive Top Leading-Edge DesignsWednesday2:00
Nasrullah, JawadPalo Alto ElectronChiplets: Where We Are TodayWednesday9:00
Nasrullah, JawadPalo Alto ElectronB-203: Chiplets in 2029 and How We Got There (Panel)Thursday3:30
Nasrullah, JawadPalo Alto ElectronPre-Conference Tutorial E: Design MethodsTuesday1:00
Nellis, Keithd-MatrixTutorial H Panel: Making the Open Chiplet Economy GrowTuesday1:00
Neustadter, DanaSynopsysA-101: Security - 1Wednesday2:00
Pancholi, VineetAmkor TechnologiesA-202: Design - 4Thursday2:00
Pantano, NicolasimecB-201: Integration - 1Thursday9:00
Paris, LluisTSMCPre-Conference Tutorial F: Working with FoundriesTuesday1:00
Pasdast, GeraldIntelPre-Conference Tutorial D: Interfaces (Section 1)Tuesday8:30 AM
Patti, RobertnHanced SemiconductorsPre-Conference Tutorial E: Design MethodsTuesday1:00
Pendurkar, RajeshTriSquare SensePre-Conference Tutorial G: AI in Chiplet DesignTuesday1:00
Posner, MickSynopsysC-103: Best Way to Optimize Chiplets (Panel)Wednesday4:30
Posner, MickSynopsysTutorial D Panel: Choosing the Right Die-to-Die Interface for Your ApplicationTuesday8:30
Ramalingam, SureshAMDC-101: Chiplets Drive Top Leading-Edge DesignsWednesday2:00
Ramamurthy, AnuMicrochipC-101: Chiplets Drive Top Leading-Edge DesignsWednesday2:00
Ramamurthy, AnuMicrochipPre-Conference Tutorial A: Chiplet BasicsTuesday8:30 AM
Ratchkov, DavidThrace SystemsPre-Conference Tutorial A: Chiplet BasicsTuesday8:30 AM
Rea, BrianUCIe ConsortiumSpecial Presentation 1: UCIe ConsortiumWednesday10:40
Ren, MarkNVIDIAPre-Conference Tutorial G: AI in Chiplet DesignTuesday1:00
Rodriguez, Luis ESiemens EDAB-103: Interfaces - 2Wednesday4:30
Roessig, TreyEmpower SemiconductorA-102: Design - 1Wednesday3:15
Rubin, JoshuaIBM ResearchD-103: Annual Update on Chiplet Design - Key Challenges and How to Meet ThemWednesday4:30
Salama, SamHyperion TechnologiesKeynote 5: Hyperion TechnologiesThursday10:50
Sandhu, GurtejMicronKeynote 3: MicronWednesday11:30
Sanyal, MadhumitaSynopsysPre-Conference Tutorial H: The New Open Chiplet EconomyTuesday1:00
Sauter, WolfgangMarvellC-201: Making Chiplets a Viable Market (sponsored by SmartSoC Solutions)Thursday9:00
Schirrmeister, FrankArteris IPTutorial D Panel: Choosing the Right Die-to-Die Interface for Your ApplicationTuesday8:30
Schirrmeister, FrankArteris IPB-103: Interfaces - 2Wednesday4:30
Sever, NirProteanTecsC-102: Next Great Breakthrough in Chiplets (Panel)Wednesday3:15
Shaizaf, ErezAlchipPre-Conference Tutorial E: Design MethodsTuesday1:00
Shankar, DeepakMIRABILIS DESIGNA-201: Design - 3Thursday9:00
Slater, StephenKeysight TechnologiesC-202: Chiplets for Entrepreneurs - Making Money in the Chiplet GameThursday2:00
Sobey, ChuckChiplet SummitChiplets: Where We Are TodayWednesday09:00
Sobey, ChuckChiplet SummitIntroduction to the 2024 Chiplet SummitWednesday8:45
Socal, FranciscoArmSpecial Presentation 4: ArmThursday11:20
Srivastava, DurgeshNVIDIASuperpanel: How Can Chiplets Accelerate Generative AI Applications?Tuesday5:00
Strothmann, TomBESIPre-Conference Tutorial E: Design MethodsTuesday1:00
Tavallaei, SiamakCXL ConsortiumA-102: Design - 1Wednesday3:15
Twombly, JeffCredo SemiconductorC-103: Best Way to Optimize Chiplets (Panel)Wednesday4:30
Uehling, TrentNXP SemiconductorsPre-Conference Tutorial A: Chiplet BasicsTuesday8:30 AM
Valluru, SridharArmB-203: Chiplets in 2029 and How We Got There (Panel)Thursday3:30
Valluru, SridharArmC-103: Best Way to Optimize Chiplets (Panel)Wednesday4:30
Verma, TarunSilicon CatalystC-202: Chiplets for Entrepreneurs - Making Money in the Chiplet GameThursday2:00
Vinnakota, BapiOpen Compute ProjectKeynote 6: Open Compute ProjectThursday11:35
Vinnakota, BapiOpen Compute ProjectB-203: Chiplets in 2029 and How We Got There (Panel)Thursday3:30
Walker, ClintAlphawave SemiC-201: Making Chiplets a Viable Market (sponsored by SmartSoC Solutions)Thursday9:00
Watanabe, AtomIBM ResearchPre-Conference Tutorial C: Advanced Packaging MethodsTuesday8:30 AM
Watanabe, AtomIBM ResearchB-202: Best Packaging for Chiplets Today (Panel)Thursday2:00
Weling, MilindEMD ElectronicsC-102: Next Great Breakthrough in Chiplets (Panel)Wednesday3:15
Witek, KeithTenstorrentC-202: Chiplets for Entrepreneurs - Making Money in the Chiplet GameThursday2:00
Wong, BillElectronic DesignB-203: Chiplets in 2029 and How We Got There (Panel)Thursday3:30
Wong, BillElectronic DesignSuperpanel: How Can Chiplets Accelerate Generative AI Applications?Tuesday5:00
Wong, JamesPalo Alto ElectronPre-Conference Tutorial D: Interfaces (Section 1)Tuesday8:30 AM
Wong, JamesPalo Alto ElectronA-202: Design - 4Thursday2:00
Wong, StephenIntelD-103: Annual Update on Chiplet Design - Key Challenges and How to Meet ThemWednesday4:30
Wong, StephenIntelB-101: Interfaces - 1Wednesday2:00
Woopoung Kim, VincentSamsungC-202: Chiplets for Entrepreneurs - Making Money in the Chiplet GameThursday2:00
Workman, ThomasAdeiaPre-Conference Tutorial C: Advanced Packaging MethodsTuesday8:30 AM
Yee, KevinSamsung SemiconductorC-201: Making Chiplets a Viable Market (sponsored by SmartSoC Solutions)Thursday9:00
Zhou, FengSilicon Storage TechnologyA-201: Design - 3Thursday9:00
Zorian, YervantSynopsysPre-Conference Tutorial D: Interfaces (Section 1)Tuesday8:30 AM