| Agarwal, Ravi | Meta | C-201: Making Chiplets a Viable Market (sponsored by SmartSoC Solutions) | Thursday | 9:00 |
| Alon, Elad | Blue Cheetah Analog Design | Pre-Conference Tutorial D: Interfaces (Section 1) | Tuesday | 8:30 AM |
| Alon, Elad | Blue Cheetah Analog Design | Tutorial H Panel: Making the Open Chiplet Economy Grow | Tuesday | 1:00 |
| Alon, Elad | Blue Cheetah Analog Design | C-103: Best Way to Optimize Chiplets (Panel) | Wednesday | 4:30 |
| Alon, Elad | Blue Cheetah Analog Design | Tutorial D Panel: Choosing the Right Die-to-Die Interface for Your Application | Tuesday | 8:30 |
| An, Jinho | Applied Materials | C-101: Chiplets Drive Top Leading-Edge Designs | Wednesday | 2:00 |
| Ardalan, Shahab | Enosemi | C-103: Best Way to Optimize Chiplets (Panel) | Wednesday | 4:30 |
| Basoco, Nitza | Teradyne | C-102: Next Great Breakthrough in Chiplets (Panel) | Wednesday | 3:15 |
| Berry, Mark | COT-NPI Group | B-201: Integration - 1 | Thursday | 9:00 |
| Best, Scott | Rambus | C-202: Chiplets for Entrepreneurs - Making Money in the Chiplet Game | Thursday | 2:00 |
| Bishop, Craig | Deca Technologies | Pre-Conference Tutorial C: Advanced Packaging Methods | Tuesday | 8:30 AM |
| Borrill, Paul | Daedaelus | Superpanel: How Can Chiplets Accelerate Generative AI Applications? | Tuesday | 5:00 |
| Borrill, Paul | Daedaelus | B-102: Applications - 1 | Wednesday | 3:15 |
| Bozman, Jean | Cloud Architects Advisors | C-102: Next Great Breakthrough in Chiplets (Panel) | Wednesday | 3:15 |
| Bozman, Jean | Cloud Architects Advisors | C-103: Best Way to Optimize Chiplets (Panel) | Wednesday | 4:30 |
| Bozman, Jean | Cloud Architects Advisors | Pre-Conference Tutorial F: Working with Foundries | Tuesday | 1:00 |
| Brookwood, Nathan | Insight 64 | D-101: Annual Update on Packaging | Wednesday | 2:00 |
| Brookwood, Nathan | Insight 64 | D-102: Annual Update on Die-to-Die Interfaces | Wednesday | 3:15 |
| Cameron, Kevin | Cameron EDA | Pre-Conference Tutorial G: AI in Chiplet Design | Tuesday | 1:00 |
| Chakraborty, Abhijeet | Synopsys | Keynote 2: Synopsys | Wednesday | 10:50 |
| Chan Carusone, Tony | Alphawave Semi | Keynote 4: Alphawave Semi | Thursday | 10:10 |
| Chang, Norman | Ansys | Pre-Conference Tutorial G: AI in Chiplet Design | Tuesday | 1:00 |
| Chen, Kevin | Lam Research | Superpanel: How Can Chiplets Accelerate Generative AI Applications? | Tuesday | 5:00 |
| Cone, Chris | Siemens | Pre-Conference Tutorial C: Advanced Packaging Methods | Tuesday | 8:30 AM |
| DeLaCruz, Javier | Arm | D-103: Annual Update on Chiplet Design - Key Challenges and How to Meet Them | Wednesday | 4:30 |
| Donnelly, Kevin | Eliyan | Tutorial D Panel: Choosing the Right Die-to-Die Interface for Your Application | Tuesday | 8:30 |
| Dutoit, Denis | CEA-List | A-201: Design - 3 | Thursday | 9:00 |
| Dutoit, Denis | CEA-List | C-101: Chiplets Drive Top Leading-Edge Designs | Wednesday | 2:00 |
| Dutoit, Denis | CEA-List | A-103: Design - 2 | Wednesday | 4:30 |
| Elkanovich, Igor | Global Unichip (GUC) | B-201: Integration - 1 | Thursday | 9:00 |
| Fahey, Paul | SK hynix | Superpanel: How Can Chiplets Accelerate Generative AI Applications? | Tuesday | 5:00 |
| Faith, Brian | QuickLogic | C-202: Chiplets for Entrepreneurs - Making Money in the Chiplet Game | Thursday | 2:00 |
| Farjadrad, Ramin | Eliyan | B-103: Interfaces - 2 | Wednesday | 4:30 |
| Farjadrad, Ramin | Eliyan | C-201: Making Chiplets a Viable Market (sponsored by SmartSoC Solutions) | Thursday | 9:00 |
| Felton, Keith | Siemens | Pre-Conference Tutorial G: AI in Chiplet Design | Tuesday | 1:00 |
| Ferguson, John | Siemens | Pre-Conference Tutorial F: Working with Foundries | Tuesday | 1:00 |
| Ferguson, John | Siemens | A-103: Design - 2 | Wednesday | 4:30 |
| Ferguson, John | Siemens | A-101: Security - 1 | Wednesday | 2:00 |
| Finnegan, Jim | Netronome | C-102: Next Great Breakthrough in Chiplets (Panel) | Wednesday | 3:15 |
| Franzon, Paul | North Carolina State University | B-202: Best Packaging for Chiplets Today (Panel) | Thursday | 2:00 |
| Fulton, Pam | Intel | Pre-Conference Tutorial F: Working with Foundries | Tuesday | 1:00 |
| Giuliano, Letizia | Alphawave Semi | D-103: Annual Update on Chiplet Design - Key Challenges and How to Meet Them | Wednesday | 4:30 |
| Giuliano, Letizia | Alphawave Semi | Tutorial H Panel: Making the Open Chiplet Economy Grow | Tuesday | 1:00 |
| Giuliano, Letizia | Alphawave Semi | Pre-Conference Tutorial H: The New Open Chiplet Economy | Tuesday | 1:00 |
| Giuliano, Letizia | Alphawave Semi | Tutorial D Panel: Choosing the Right Die-to-Die Interface for Your Application | Tuesday | 8:30 |
| Giuliano, Letizia | Alphawave Semi | D-102: Annual Update on Die-to-Die Interfaces | Wednesday | 3:15 |
| Grossner, Cliff | Open Compute Project (OCP) | Keynote 6: Open Compute Project | Thursday | 11:35 |
| Grossner, Cliff | Open Compute Project (OCP) | Pre-Conference Tutorial H: The New Open Chiplet Economy | Tuesday | 1:00 |
| Hackenberg, Tom | Yole Group | B-203: Chiplets in 2029 and How We Got There (Panel) | Thursday | 3:30 |
| Hackenberg, Tom | Yole Group | Tutorial H Panel: Making the Open Chiplet Economy Grow | Tuesday | 1:00 |
| Harrison, Lee | Siemens | A-101: Security - 1 | Wednesday | 2:00 |
| Heinig, Andy | Fraunhofer IIS | Pre-Conference Tutorial H: The New Open Chiplet Economy | Tuesday | 1:00 |
| Heinig, Andy | Fraunhofer IIS | Pre-Conference Tutorial D: Interfaces (Section 1) | Tuesday | 8:30 AM |
| Hossam, Nermeen | Siemens | A-103: Design - 2 | Wednesday | 4:30 |
| Hutchins, Jeff | Ranovus | B-103: Interfaces - 2 | Wednesday | 4:30 |
| Ilyadis, Nick | Achronix | Pre-Conference Tutorial D: Interfaces (Section 1) | Tuesday | 8:30 AM |
| Ilyadis, Nick | Achronix | Superpanel: How Can Chiplets Accelerate Generative AI Applications? | Tuesday | 5:00 |
| Ilyadis, Nick | Achronix | B-103: Interfaces - 2 | Wednesday | 4:30 |
| Ilyadis, Nick | Achronix | B-101: Interfaces - 1 | Wednesday | 2:00 |
| Islam, Nokibul | JCET Group | B-202: Best Packaging for Chiplets Today (Panel) | Thursday | 2:00 |
| Islam, Nokibul | JCET Group | B-102: Applications - 1 | Wednesday | 3:15 |
| Islam, Nokibul | JCET Group | Pre-Conference Tutorial C: Advanced Packaging Methods | Tuesday | 8:30 AM |
| Jani, Dharmesh | Meta | B-101: Interfaces - 1 | Wednesday | 2:00 |
| Jani, Dharmesh | Meta | Tutorial H Panel: Making the Open Chiplet Economy Grow | Tuesday | 1:00 |
| Johal, Kash | YorChip | A-103: Design - 2 | Wednesday | 4:30 |
| Joly, Sylvie | CEA-List | B-201: Integration - 1 | Thursday | 9:00 |
| Kaltran, Dan | Epirus | A-103: Design - 2 | Wednesday | 4:30 |
| Kamal, Pratyush | Siemens | A-202: Design - 4 | Thursday | 2:00 |
| Kareenahalli, Surya | Intel | Pre-Conference Tutorial A: Chiplet Basics | Tuesday | 8:30 AM |
| Keding, Holger | Synopsys | Pre-Conference Tutorial E: Design Methods | Tuesday | 1:00 |
| Kelly, Mike | Amkor | D-101: Annual Update on Packaging | Wednesday | 2:00 |
| Kengeri, Subi | Applied Materials | Keynote 1: Applied Materials | Wednesday | 10:10 |
| Kepler, Nick | Silicon Catalyst | Special Presentation 2: Silicon Catalyst | Wednesday | 11:20 |
| Keppens, Bart | Sofics | A-202: Design - 4 | Thursday | 2:00 |
| Knight, Mark | Arm | Special Presentation 4: Arm | Thursday | 11:20 |
| Knight, Mark | Arm | C-102: Next Great Breakthrough in Chiplets (Panel) | Wednesday | 3:15 |
| Kohli, Vince | Impact VC | C-202: Chiplets for Entrepreneurs - Making Money in the Chiplet Game | Thursday | 2:00 |
| Kumar, Arun | Synopsys | Pre-Conference Tutorial A: Chiplet Basics | Tuesday | 8:30 AM |
| Kumar, Arvind | IBM | C-101: Chiplets Drive Top Leading-Edge Designs | Wednesday | 2:00 |
| Lalgudi, Subramanian | Siemens | A-201: Design - 3 | Thursday | 9:00 |
| Lalgudi, Subramanian | Siemens | A-102: Design - 1 | Wednesday | 3:15 |
| Lambalot, Daniel | Alphawave Semi | B-202: Best Packaging for Chiplets Today (Panel) | Thursday | 2:00 |
| Land, Ian | Synopsys India | B-102: Applications - 1 | Wednesday | 3:15 |
| Larsen, Kenneth | Synopsys | Pre-Conference Tutorial F: Working with Foundries | Tuesday | 1:00 |
| Larsen, Kenneth | Synopsys | C-101: Chiplets Drive Top Leading-Edge Designs | Wednesday | 2:00 |
| Lee, Hee-Soo | Keysight Technologies International | B-101: Interfaces - 1 | Wednesday | 2:00 |
| Leong, Amy | AEM International | Pre-Conference Tutorial A: Chiplet Basics | Tuesday | 8:30 AM |
| Lewer, Philip | Untether AI | B-102: Applications - 1 | Wednesday | 3:15 |
| Lewer, Philip | Untether AI | C-103: Best Way to Optimize Chiplets (Panel) | Wednesday | 4:30 |
| Lin, Lang | Ansys | A-102: Design - 1 | Wednesday | 3:15 |
| Lujan, Amy | Savansys Solutions | Pre-Conference Tutorial C: Advanced Packaging Methods | Tuesday | 8:30 AM |
| McIntyre, David | SNIA Board of Directors | Special Presentation 3: SNIA | Thursday | 10:40 |
| McIntyre, David | Samsung Semiconductor | Tutorial D Panel: Choosing the Right Die-to-Die Interface for Your Application | Tuesday | 8:30 |
| McIntyre, David | Samsung Semiconductor | Pre-Conference Tutorial D: Interfaces | Tuesday | 08:30 AM |
| Mehta, Manish | Broadcom | Pre-Conference Tutorial D: Interfaces (Section 1) | Tuesday | 8:30 AM |
| Merlo, Pedro | Keysight Technologies | D-103: Annual Update on Chiplet Design - Key Challenges and How to Meet Them | Wednesday | 4:30 |
| Mirkarimi, Laura | Adeia | B-202: Best Packaging for Chiplets Today (Panel) | Thursday | 2:00 |
| Mittal, Rohit | Google | Superpanel: How Can Chiplets Accelerate Generative AI Applications? | Tuesday | 5:00 |
| Mota, Manuel | Synopsys | B-101: Interfaces - 1 | Wednesday | 2:00 |
| Naeimi, Helia | Tenstorrent | C-101: Chiplets Drive Top Leading-Edge Designs | Wednesday | 2:00 |
| Nasrullah, Jawad | Palo Alto Electron | Chiplets: Where We Are Today | Wednesday | 9:00 |
| Nasrullah, Jawad | Palo Alto Electron | B-203: Chiplets in 2029 and How We Got There (Panel) | Thursday | 3:30 |
| Nasrullah, Jawad | Palo Alto Electron | Pre-Conference Tutorial E: Design Methods | Tuesday | 1:00 |
| Nellis, Keith | d-Matrix | Tutorial H Panel: Making the Open Chiplet Economy Grow | Tuesday | 1:00 |
| Neustadter, Dana | Synopsys | A-101: Security - 1 | Wednesday | 2:00 |
| Pancholi, Vineet | Amkor | A-202: Design - 4 | Thursday | 2:00 |
| Pantano, Nicolas | imec | B-201: Integration - 1 | Thursday | 9:00 |
| Paris, Lluis | TSMC | Pre-Conference Tutorial F: Working with Foundries | Tuesday | 1:00 |
| Pasdast, Gerald | Intel | Pre-Conference Tutorial D: Interfaces (Section 1) | Tuesday | 8:30 AM |
| Patti, Robert | nHanced Semiconductors | Pre-Conference Tutorial E: Design Methods | Tuesday | 1:00 |
| Pendurkar, Rajesh | TriSquare Sense | Pre-Conference Tutorial G: AI in Chiplet Design | Tuesday | 1:00 |
| Posner, Mick | Synopsys | C-103: Best Way to Optimize Chiplets (Panel) | Wednesday | 4:30 |
| Posner, Mick | Synopsys | Tutorial D Panel: Choosing the Right Die-to-Die Interface for Your Application | Tuesday | 8:30 |
| Ramalingam, Suresh | AMD | C-101: Chiplets Drive Top Leading-Edge Designs | Wednesday | 2:00 |
| Ramamurthy, Anu | Microchip | C-101: Chiplets Drive Top Leading-Edge Designs | Wednesday | 2:00 |
| Ramamurthy, Anu | Microchip | Pre-Conference Tutorial A: Chiplet Basics | Tuesday | 8:30 AM |
| Ratchkov, David | Thrace Systems | Pre-Conference Tutorial A: Chiplet Basics | Tuesday | 8:30 AM |
| Rea, Brian | UCIe (Universal Chiplet Interconnect Express) | Special Presentation 1: UCIe Consortium | Wednesday | 10:40 |
| Ren, Mark | NVIDIA | Pre-Conference Tutorial G: AI in Chiplet Design | Tuesday | 1:00 |
| Rodriguez, Luis E | Siemens | B-103: Interfaces - 2 | Wednesday | 4:30 |
| Roessig, Trey | Empower Semiconductor | A-102: Design - 1 | Wednesday | 3:15 |
| Rubin, Joshua | IBM Research | D-103: Annual Update on Chiplet Design - Key Challenges and How to Meet Them | Wednesday | 4:30 |
| Salama, Sam | Hyperion Technologies | Keynote 5: Hyperion Technologies | Thursday | 10:50 |
| Sandhu, Gurtej | Micron | Keynote 3: Micron | Wednesday | 11:30 |
| Sanyal, Madhumita | Synopsys | Pre-Conference Tutorial H: The New Open Chiplet Economy | Tuesday | 1:00 |
| Sauter, Wolfgang | Marvell | C-201: Making Chiplets a Viable Market (sponsored by SmartSoC Solutions) | Thursday | 9:00 |
| Schirrmeister, Frank | Synopsys | Tutorial D Panel: Choosing the Right Die-to-Die Interface for Your Application | Tuesday | 8:30 |
| Schirrmeister, Frank | Synopsys | B-103: Interfaces - 2 | Wednesday | 4:30 |
| Sever, Nir | ProteanTecs | C-102: Next Great Breakthrough in Chiplets (Panel) | Wednesday | 3:15 |
| Shaizaf, Erez | Alchip | Pre-Conference Tutorial E: Design Methods | Tuesday | 1:00 |
| Shankar, Deepak | MIRABILIS DESIGN | A-201: Design - 3 | Thursday | 9:00 |
| Slater, Stephen | Keysight Technologies International | C-202: Chiplets for Entrepreneurs - Making Money in the Chiplet Game | Thursday | 2:00 |
| Sobey, Chuck | Chiplet Summit | Chiplets: Where We Are Today | Wednesday | 09:00 |
| Sobey, Chuck | Chiplet Summit | Introduction to the 2024 Chiplet Summit | Wednesday | 8:45 |
| Socal, Francisco | ARM | Special Presentation 4: Arm | Thursday | 11:20 |
| Srivastava, Durgesh | MIPS | Superpanel: How Can Chiplets Accelerate Generative AI Applications? | Tuesday | 5:00 |
| Strothman, Tom | BESI | Pre-Conference Tutorial E: Design Methods | Tuesday | 1:00 |
| Tavallaei, Siamak | CXL Consortium | A-102: Design - 1 | Wednesday | 3:15 |
| Twombly, Jeff | Credo Semiconductor | C-103: Best Way to Optimize Chiplets (Panel) | Wednesday | 4:30 |
| Uehling, Trent | NXP Semiconductors | Pre-Conference Tutorial A: Chiplet Basics | Tuesday | 8:30 AM |
| Valluru, Sridhar | Arm | B-203: Chiplets in 2029 and How We Got There (Panel) | Thursday | 3:30 |
| Valluru, Sridhar | Arm | C-103: Best Way to Optimize Chiplets (Panel) | Wednesday | 4:30 |
| Verma, Tarun | Silicon Catalyst | C-202: Chiplets for Entrepreneurs - Making Money in the Chiplet Game | Thursday | 2:00 |
| Vinnakota, Bapi | Open Compute Project | Keynote 6: Open Compute Project | Thursday | 11:35 |
| Vinnakota, Bapi | Open Compute Project | B-203: Chiplets in 2029 and How We Got There (Panel) | Thursday | 3:30 |
| Walker, Clint | Alphawave Semi | C-201: Making Chiplets a Viable Market (sponsored by SmartSoC Solutions) | Thursday | 9:00 |
| Watanabe, Atom | IBM Research | Pre-Conference Tutorial C: Advanced Packaging Methods | Tuesday | 8:30 AM |
| Watanabe, Atom | IBM Research | B-202: Best Packaging for Chiplets Today (Panel) | Thursday | 2:00 |
| Weling, Milind | EMD Electronics | C-102: Next Great Breakthrough in Chiplets (Panel) | Wednesday | 3:15 |
| Witek, Keith | Tenstorrent | C-202: Chiplets for Entrepreneurs - Making Money in the Chiplet Game | Thursday | 2:00 |
| Wong, Bill | Electronic Design | B-203: Chiplets in 2029 and How We Got There (Panel) | Thursday | 3:30 |
| Wong, Bill | Electronic Design | Superpanel: How Can Chiplets Accelerate Generative AI Applications? | Tuesday | 5:00 |
| Wong, James | Palo Alto Electron | Pre-Conference Tutorial D: Interfaces (Section 1) | Tuesday | 8:30 AM |
| Wong, James | Palo Alto Electron | A-202: Design - 4 | Thursday | 2:00 |
| Wong, Stephen | Intel | D-103: Annual Update on Chiplet Design - Key Challenges and How to Meet Them | Wednesday | 4:30 |
| Wong, Stephen | Intel | B-101: Interfaces - 1 | Wednesday | 2:00 |
| Woopoung Kim, Vincent | Samsung | C-202: Chiplets for Entrepreneurs - Making Money in the Chiplet Game | Thursday | 2:00 |
| Workman, Thomas | Adeia | Pre-Conference Tutorial C: Advanced Packaging Methods | Tuesday | 8:30 AM |
| Yee, Kevin | Samsung Semiconductor | C-201: Making Chiplets a Viable Market (sponsored by SmartSoC Solutions) | Thursday | 9:00 |
| Zhou, Feng | Silicon Storage Technology | A-201: Design - 3 | Thursday | 9:00 |
| Zorian, Yervant | Synopsys | Pre-Conference Tutorial D: Interfaces (Section 1) | Tuesday | 8:30 AM |