Paper Title: Annual Update on Packaging

Paper Abstract:

Paper Author: Mike Kelly, VP Advanced Packaging Development Integration, Amkor Technology

Author Bio: Mike joined Amkor in 2005 and has led package developments for EMI shielding, thermally enhanced packages, sensors and high density MCM packages and more recently chiplet-based packaging using high-density fan-out (HDFO) and bridges. He has worked in electronics and IC package design and manufacturing for 30 years, and has more than 40 patents in the field and holds master’s degrees in Mechanical and Chemical Engineering.