Paper Title: Using Silicon Photonics in Co-Packaged Optical Interconnect

Paper Abstract: Huge demand for AI training clusters has increased interest in optical interconnects to enable high radix, low latency network architectures. However, current optical interconnects use expensive, high-power discrete optical transceivers. A promising alternative involves highly integrated silicon photonics devices co-packaged with core compute and switch ASICs. Recent experimental work on this approach has produced encouraging results in the quest to reduce the cost and power consumption of optical interconnect. .

Paper Author: Manish Mehta, VP of Marketing and Operations, Optical Systems Division, Broadcom

Author Bio: Manish Mehta is VP Marketing/Operations for Broadcom’s Optical Systems Division at Broadcom. He leads go-to-market and operations for devices and systems used in optical communications including co-packaged optical switches used by Chinese hyperscaler Tencent. Before joining Broadcom, Manish was Executive VP Product Line Management at Source Photonics where he led the company's entry into the datacenter market. Manish earned a PhD in electrical engineering from University of California, Santa Barbara (UCSB) He has participated in several conferences including OCP Global Summit and SPIE Photonics West.