Paper Title: Using Integrated Voltage Regulators in Chiplet Designs

Paper Abstract: Today’s leading-edge chiplet designs require many voltage domains, with the designs in general requiring extra supply rails and each chiplet possibly having its own requirements as well. Furthermore, these leading-edge chips require more current. Overall, the power delivery system needs more space at a time when space is at a premium. One possible solution uses high-frequency Integrated Voltage Regulators (IVRs) inside the package, using less space while increasing performance. The internal converter’s parasitic network and bandwidth are excellent, providing a stiff dynamic with respect to the load, while keeping the external input and ground current lower. Moving power conversion inside simplifies packaging, reduces transmission losses, and improves transient performance.

Paper Author: Trey Roessig, CTO and SVP Engineering, Empower Semiconductor

Author Bio: Trey Roessig is CTO/Sr VP Engineering at Empower Semiconductor, a leading maker of integrated voltage regulators. He handles the company’s product roadmap, technology advancement, and product development. Before joining Empower, he worked at Analog Devices, where he developed power conversion products and helped grow new businesses for the company. A leading figure in power conversion, he holds 27 patents and has written 5 publications. He also developed the world’s first dual-LED flash driver. Trey earned a PhD in Mechanical Engineering / Control Systems from UC Berkeley.