Paper Title: Hierarchical Approach to Multiphysics Analysis of Chiplet-Based Designs

Paper Abstract: Today’s chiplet-based systems present huge design/verification and analysis challenges. Multiple chiplets are assembled in a 3D structure that produces complex couplings among the heterogenous components and millions of physical connections. A novel platform tackles the challenges using hierarchical modeling to build a chiplet-based system through early stage, in-design, and signoff stages for 2.5D and 3D-ICs. It can perform multiphysics analysis for power, signal, thermal, and structural integrity verification. Research is currently proceeding on applications in chiplets with post-FinFET devices, photonics, and security modules.

Paper Author: Lang Lin, Principal Engineer, Ansys

Author Bio: Lang Lin is a principal product manager at Ansys, where he works on multiphysics simulation tools for power integrity, thermal integrity, and IC security verification. Before joining Ansys, he was a senior hardware engineer at Intel leading the silicon-correlated modeling methodology of a server chip power grid network. He has authored over 20 technical publications and holds four patents. He has presented at many EDA and security conferences such as DesignCon, Design Automation Conference (DAC), and the International Symposium on Hardware Oriented Security and Trust (HOST). He earned a PhD in electrical and computer engineering from University of Massachusetts (Amherst).