Paper Title: Developing Secure Multi-Die Systems

Paper Abstract: Security is now a major issue for electronic systems at all levels, as attackers become more numerous and more sophisticated. Multi-die systems add complexity as they may involve chiplets with varied functions, technologies, and manufacturers, as well as interconnections. Attackers thus have many places to look for vulnerabilities. Key security requirements for multi-die systems include an overall plan for all levels including chiplets, systems, and interconnect. The system must achieve a high level of trust through robust per-die identification and authentication, secure communications (UCIe security), and data protection. Standards organizations must provide a set of security levels and procedures and tests for certifying that chiplets conform to them.

Paper Author: Dana Neustadter, Product Management Director, Synopsys

Author Bio: Dana Neustadter is Director Product Management for Synopsys' security solutions, where she works on problems ranging from automotive applications through interface IP and on up to quantum computing cyberattacks. She has long experience in the security, IP, semiconductor, and EDA industries with an emphasis on strategy development and marketing for security IP. She is an active blogger on security-related subjects on the Synopsys website. She has also given presentations at D&R IP-SoC Days and has written articles for SemiWiki and Semiconductor Engineering. Dana earned an MSEE from the Technical University Cluj-Napoca (Romania).