Paper Title: Multi-Die Systems for Aerospace and Defense Applications

Paper Abstract: Aerospace/defense applications must operate in harsh environments and process complex algorithms with ultra-low latency at high power efficiency. The move to multi-die systems offers scaling of functionality as well as system power and performance benefits. Key applications include electronic warfare, digital radar, and spaceborne video. Technical advances in packaging, interconnect, process technologies, and thermal management will help modernize systems, include more AI, and increase reliability and durability, along with low size, weight, and power (SWaP). However, designers must follow best practices throughout the design process. An example RF sensor processing stack shows a building block approach to radar and electronic warfare applications. The chiplet stack not only handles RF analog processing but also data conversion, adaptive beamforming, signal processing, and memory management.

Paper Author: Ian Land, Sr Solutions Director, Synopsys India

Author Bio: Ian Land is Synopsys’s Director of Security, Government, and Aerospace Solutions. He handles product marketing, product planning, business development, strategic alliances, and business analysis. Before joining Synopsys, he was Director of Intel’s Public Sector Business Unit which sold embedded CPU products worldwide. He has also worked for Altera and Xilinx. He is a frequent blogger on military/defense applications and has been active at Synopsys User Group (SNUG) meetings. He earned master's degrees in mechanical engineering and management from MIT.