Paper Title: eFPGA Solutions for Flexible Die to Die Protocol Adapters

Paper Abstract: Today there are a multitude of die to die interfaces. Standardization is occurring at the physical and data link layers. The protocol layers are still in flux and many proprietary implementations exist. Providing flexibility in how that protocol layer is parsed and processed can be a complex task that may not be future proof with hardened logic. We will show how eFPGA IP can be used in chiplets to provide a flexible and adaptable interface engine. This can be programmed to parse and process the protocol layer of newly defined die to die interfaces. This talk will describe the various implementations and how the eFPGA technology can provide a future proof option for providing flexibility at the protocol layer.

Paper Author: Nick Ilyadis, VP Product Planning, Achronix

Author Bio: Nick Ilyadis is Senior Director of Product Planning at Achronix, where he oversees all aspects of product planning from concept through production. Nick has 35 years of data and semiconductor engineering and manufacturing experience and holds 75 issued patents. A recognized expert on software and hardware development and quality control, he was previously VP Portfolio/Technology Strategy at Marvell Semiconductor and VP/Group CTO at Broadcom. He has extensive domain knowledge across semiconductors, networking, 5G, data centers, and automotive applications. He earned an MSEE in VLSI Technology from the University of New Hampshire. Nick has been active in many industry groups including the Ethernet Alliance and has participated in many conferences including HP Discover, OFC, Infocom, and Ethernet Technology Summit.