Paper Title: Improving Electromagnetic Simulation for Chiplet-Based IC Designs

Paper Abstract: Chiplet-based design places new stress on EDA tools and methodologies used for system-level architectural exploration, physical implementation, analysis/sign-off, verification, and design for manufacturing. Electromagnetic simulation tools, in particular, must handle both chip-level and package-level issues. The result is long run times and large memory requirements which both increase cost and slow down the design process. A new EM solver delivers unprecedented performance (10X faster and 20X smaller memory) with uncompromised accuracy. The solver’s multiscale capability makes it suitable for die-interposer-package co-simulations. Benchmark examples on advanced packaging platforms demonstrate its accuracy and efficiency.

Paper Author: Feng Ling, CEO & Founder, Xpeedic

Author Bio: Feng Ling is the founder/CEO of Xpeedic, a leading EDA provider for IC, package, and system designs. Before founding Xpeedic, he was VP Engineering at Physware, later acquired by Siemens EDA. He also worked at Cadence Design Systems through Neolinear acquisition. He holds four patents, has written three book chapters, and has over 60 publications in refereed journals and conference proceedings. He earned a PhD in electrical engineering from the University of Illinois at Urbana-Champaign (UIUC). He was the General Chair of SiP Conference China 2021.