Paper Title: Achieving More Efficient Test for Chiplet-Based Designs

Paper Abstract: Chiplet-based design adds new issues to testing. Tests must now cover individual chiplets, the interconnections among them, and the entire package. Such extended testing could significantly increase time-to-market. How can developers limit the effects to an affordable level? Can design for test (DFT) methods help with test coverage and simplify production testing? Developers must stress automation and evaluate new techniques such as agent-based monitoring. Test considerations must play a key role in heterogenous integration and package design. Only a through integration of test with the entire development process will do the job. Due to higher levels of integration at the package level, manufacturing test flows must be altered for more optimal test coverage.

Paper Author: Andrei Berar, Sr Director Test Business Development, Amkor Technologies

Author Bio: