Paper Title: An Open Interconnect Standard Between Chiplets Within a Package

Paper Abstract:

Paper Author: Gerald Pasdast, Form Factor and Compliance Working Group Chair, UCIe™ Consortium

Author Bio: Anu Ramamurthy is a Sr Staff Engineer at Microchip Technology, where she works on heterogeneous integration and advanced packaging. She also has expertise in physical design and procurement management of 3rd party IP. Before joining Microchip, she worked at Microsemi and Vitesse Semiconductor as a design engineer and engineering manager. She earned an MS in semiconductor devices from North Carolina State University.