Wednesday, January 25th 02:00-3:00 PM | D-101: Annual Update on Packaging (Annual Update Track) | | Paper Title: Annual Update on Packaging
Paper Abstract: Packaging has become a much more important stage with the advent of chiplet-based design. The package must support a whole array of chiplets plus an interface that interconnects them.
Paper Author: Andy Heinig, Group Leader, Fraunhofer IIS
Author Bio:
|
|