Wednesday, January 25th
02:00-3:00 PM
D-101: Annual Update on Packaging (Annual Update Track)
Paper Title: Annual Update on Packaging

Paper Abstract: Packaging has become a much more important stage with the advent of chiplet-based design. The package must support a whole array of chiplets plus an interface that interconnects them.

Paper Author: Andy Heinig, Group Leader, Fraunhofer IIS

Author Bio: