Paper Title: The Emerging Chiplet Economy

Paper Abstract: Developing drop-in chiplets requires careful attention to standards development. There must be standards for chiplet interfaces, power consumption, thermals, size, and performance levels.

Paper Author: Bapi Vinnakota, System Architect, Broadcom

Author Bio: Bapi Vinnakota currently leads the Open Domain-Specific Architecture (ODSA) sub-project within the Open Compute Project (OCP). At OCP, he is working on establishing an open chiplet economy, including the Bunch of Wires (BoW) die-to-die interconnect standard. He previously held engineering management positions at Broadcom, Netronome, and Intel. He has long been involved in open communities, including creating Open-NFP, which enables programmable data plane acceleration research. He has several publications on ODSA and BoW, including an invited talk at the ACM/IEEE International Workshop on System-Level Interconnect Pathfinding (SLIP), presentations at Hot Interconnects, and an article in IEEE Micro. He has also been a professor at the University of Minnesota. He earned a PhD in computer engineering from Princeton University.