Paper Title: Adaptive Patterning in Advanced Packaging Methods

Paper Abstract: Adaptive patterning is a method used to promote design-for-manufacturing (DFM) for semiconductor devices.

Paper Author: Craig Bishop, CTO, Deca Technologies

Author Bio: Craig Bishop is CTO at Deca Technologies, a developer of products for semiconductor packaging and manufacturing. Bishop was a major contributor to the company's primary products, the M-Series Wafer Level Package and Adaptive Patterning, a method used to promote design-for-manufacturing (DFM) for semiconductor devices. Bishop has given presentations on Adaptive Patterning at the International Conference on Device Packaging, the International Water-Level Packaging Conference, and the Electronic Components and Technology Conference (ECTC). He earned a BS in Electrical and Computer Engineering from the University of Arizona. He holds over 80 patents, mostly on semiconductor packaging and manufacturing.