Paper Title: Issues in Advanced Packaging for Chiplets

Paper Abstract: Presentation describes issues in advanced packaging for chiplets

Paper Author: Lihong Cao, Director Engineering, ASE Group

Author Bio: Lihong Cao is Sr Director Marketing/Engineering at ASE Group, where she is responsible for advanced packaging technology development for chiplets. She also works on heterogeneous integration, strategic planning, and business engagement. She was previously a Sr Manager at AMD, where she was a key contributor to TSV 2.5D/3D solutions. She holds several US patents, has published more than 80 technical papers, and has presented at many international conferences such as the Wafer-Level Packaging Symposium and the International Conference on Device Packaging. She earned a PhD in materials science and engineering.