Paper Title: Managing Heat and Power in Today's Chiplet-Based Designs

Paper Abstract: Moore’s Law predicted the sustained scaling that our industry has enjoyed for decades. End consumers have come to expect ever-increasing functionality at lower cost with each passing year. However, in the coming decade the limits of physics will forcibly slow the pace of scaling, perhaps all but ending it. In the face of this issue, the industry is looking for new ways to fulfill the end consumer’s expectations. Advanced packaging emerged as the best near-term solution to mitigate the roll-off of geometric semiconductor scaling. The power of 2.5D/3D circuit integration lies in its ability to intimately integrate diverse materials and processes as well as reduce wire length. While this makes a 100-500% improvement in performance possible, it also presents possible new issues from the increased power density requirement and associated heat concentration. This talk will discuss the advancements, processes, and methods for both 2.5D and 3D fabrication at small and medium scale. It will address power distribution and limits of thermal dissipation as well as techniques to improve upon the current limitations.

Paper Author: Robert Patti, President, nHanced Semiconductors

Author Bio: Bob is the president of NHanced Semiconductors, Inc. and has spearheaded the development and delivery of cutting-edge 3D and 2.5D integration technology for high energy physics, medicine, automotive, military, HPC, and other fields. He has managed hardware engineering teams in several organizations, including successful startups. Bob received the 2009 SEMI Award for North America for his pioneering work in 3D IC integration and the 2015 3DIncites Individual Achievement Award.