Paper Title: Test Impacts of Multi-Die Packages

Paper Abstract: Multi-die packages have a major impact on testing. Not only must individual dies be tested, but so also must the complete package and the interfaces between dies. If the packages contain many dies, testing costs could soar. An obvious solution is to include only dies that have been fully pre-tested according to an agreed standard. Now only the interfaces and the complete package must be tested, assuming that the test procedures allow for interactions between dies.

Paper Author: Vineet Pancholi, Sr Director Test Technology, Amkor

Author Bio: Vineet Pancholi is Sr Director/Test Technologist at Amkor, where he leads the test technology efforts. Before joining Amkor, he was a test engineer at Intel and Microchip. He is a frequent conference participant at such events as MEPTEC’s Road to Chiplets – Design Integration, IEEE VLSI Test Symposium, the Technology Unites Global Summit, and the IMAPS Advanced SiP Technology Conference. He has also written articles on testing for Semiconductor Engineering and 3D InCites. He earned an MSEE at Arizona State University.