Tuesday, January 24th 01:00-5:00 PM | Pre-Conference Tutorial F: Power and Thermal (Pre-Conference Tutorials Track) | Organizer: Andras Vass-Varnai, Portfolio Development Executive, Siemens EDA | Paper Title: Some Like It Hot: The Complete Guide to Thermals for Chiplets
Paper Abstract: Some Like It Hot: The Complete Guide to Thermals for Chiplets
Paper Author: David Ratchkov, CTO and Co-Founder, Anemoi Software
Author Bio: David Ratchkov is the CTO/co-founder of Anemoi Software, a startup which is developing cloud-native thermal analysis tools for solving large, complex design problems. He is also the CEO of Thrace Systems, developer of an integration platform that provides full chip power dissipation analysis throughout the product design and validation cycle. An experienced hardware and software developer, he was previously a Principal Engineer at Broadcom, where he developed power analysis tools. He earned a master’s degree in mathematics and computer science from the University of Plovdiv (Bulgaria). He also leads the Chiplet Design Exchange (CDX) workstream under Open Compute Platform's Open Domain-Specific Architecture (ODSA) sub-project.
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