Paper Title: Chiplet Integration Based on Design for Manufacturability and Cost Factors

Paper Abstract: Almost all major semiconductor companies use chiplets to make their most advanced systems designed on the latest process nodes. The complex new step in this approach is integration, which involves utilizing advanced packaging techniques to combine circuit elements and interconnecting them to form the devices. There are many approaches in use. In general, they focus on scaling the interconnect, reducing L/S via interconnect and bump pitch to minimize the performance penalties created by the integration scheme. The local interconnections may go to an interposer or bridge or through redistribution layers fanned out across the aggregated chiplets. Even when optimized, such approaches still add complexity to testing and design and may compromise manufacturability, increasing lead time and cost. Moreover, power delivery and thermal management remain a common challenge for all current integration methods. A revolutionary interconnect approach addresses these issues while offering a scalable manufacturing solution based on design for cost and manufacturability. It also helps increases the scalability of chiplet integration.

Paper Author: Sam Salama, CEO, Hyperion

Author Bio: Sam Salama is the CEO of Hyperion Technologies, a manufacturer of microelectronic systems. His goal is to establish an independent merchant provider of system-level solutions. Before founding Hyperion, he was a VP/GM at Intel, where he managed the $3.5B annual packaging and high-density interconnect substrate business. His organization led a network of 18 global high-volume manufacturing factories producing more than 1B units annually. A global value creator, Dr. Salama has productized multiple industry-first technologies. He is a board member at several microsystems, photonics, and advanced manufacturing companies. He holds over 130 patents and has published over 30 technical articles, book chapters, and industry reviews. He earned a PhD in materials engineering and laser materials processing from the University of Central Florida.