Tuesday, January 24th
08:30-Noon
Pre-Conference Tutorial D: Interfaces (Pre-Conference Tutorials Track)
Paper Title: Chiplet Integration on Advanced Packaging and System Realization Opportunities

Paper Abstract: We will first review key elements in advanced packaging that enable dense die-to-die interface communications. Heterogeneous integration techniques, including high density laminates, high density interposers, wafer-level packaging, and other emerging technologies to be leveraged for chiplet integration will be discussed. We next introduce our approach to supporting the BoW interface from both a signal integrity and power integrity perspective, including the modeling of circuit-level design, data-lane transmission lines, and the power delivery network. The presentation will conclude by highlighting the challenges that chiplet connectivity solutions must overcome to support the high computing demands of AI and ML, ultra-fast networking, sensor fusion, and next-generation mobile devices.

Paper Author: Atom Watanabe, Research Staff Member, IBM

Author Bio: Atom Watanabe is a Research Staff Member at the IBM TJ Watson Research Center, where he works on IC packaging, 5G and millimeter-wave systems, RF electronics, and antenna design. His current research interests and expertise include high-frequency packaging, signal and power integrity analysis, and emerging approaches for multi-chiplet heterogeneous integration. He has over 40 publications in such journals as Applied Physics Letters, IEEE Transactions on Electromagnetic Compatibility, IEEE Transaction on Components, Packaging, and Manufacturing Technology, and IEEE Transactions on Microwave Theory and Techniques, and at such conferences as Electronic Components and Technology Conference (ECTC) and the International Symposium on Microelectronics. Dr. Watanabe has also received several paper awards. He earned a PhD in electrical and computer engineering from the Georgia Institute of Technology.