Paper Title: Successful Implementation of Chiplet-Based Heterogeneous Advanced Packages

Paper Abstract: Using chiplets and heterogeneous integration to form a high-performing System-In-Package requires a different approach from the one used to create a monolithic solution. A chiplet-based approach must include micro-architecture partitioning through prototyping/planning of an optimum scenario down to detailed integration and implementation, verification, and signoff. Experience has shown that an approach using five key workflows enables semiconductor design teams to implement chiplet-based designs both efficiently and expeditiously.

Paper Author: Keith Felton, Product Marketing Manager, Siemens EDA

Author Bio: Keith Felton is a Product Marketing Manager for Siemens EDA, where he works on High-Density Advanced Packaging (HDAP) solutions for heterogeneous semiconductor packaging integration. He focuses on driving the strategy and direction for multi-substrate prototyping, design, and verification. He has worked extensively on IC package design for over 30 years and drove the launch of the industry's first dedicated System-In-Package (SiP) design solution. He has delivered multiple papers and keynotes at conferences such as MEPTEC, IMAPS-DPC, IMAPS-SiP, and IWLPC, and has written multiple articles on design methods. He also holds an important co-inventor patent on concurrent design of modules. He studied mechanical engineering at Southend Technical College (Southend-on-Sea, UK).