Paper Title: Using Chiplets to Develop Advanced Driver Assistance Systems (ADAS) for Vehicles

Paper Abstract: The development of autonomous vehicles and advanced driver assistance systems (ADAS) is leading to unprecedented electronics content in automotive systems. The processing power required has also grown astronomically. Designers must use advanced technology nodes for both digital and memory devices to get enough performance while minimizing power consumption. Designing such engine control units using a monolithic SoC approach would be costly and time-consuming. Chiplet-based approaches reduce development time and cost, but introduce new challenges such as high-speed interfaces and heterogeneous integration. Choosing the right approach for a particular application requires a team with expertise in all stages from partitioning (disaggregation) through packaging, test, and manufacturing.

Paper Author: Andy Heinig, Group Leader, Fraunhofer IIS

Author Bio: Andy Heinig is the Technical Leader of the Advanced Packaging Workgroup at the Fraunhofer Institute IIS/EAS, where he works on assembly design kits and design flows for packaging. He has started several major German and European research projects in design and design automation for advanced packaging. He has also worked extensively in several standardization groups such as SI2. Heinig has 55 publications, including presentations at important conferences such as the Electronic Components Technology Conference (ECTC), Electronic Packaging Technology Conference, and the IEEE Conference on Electronics, Circuits, and Systems (ICECS), and in journals such as the IEEE Transactions on Components, Packaging, and Manufacturing Technology. He earned a Diploma degree in information technology from the Technical University of Cottbus (Germany).