Thursday, January 26th |
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C-201: Best Packaging for Chiplets Today Panel (sponsored by ASE) (Panel Track) | | Panel Members:
| Panelist: Daniel Lambalot, Sr Principal Engineer, Alphawave SemiPanelist: Laura Mirkarimi, VP 3D Technologies, AdeiaPanelist: Syrus Ziai, VP Engineering, EliyanPanelist: Dick Otte, CEO, Promex IndustriesPanelist: Mike Kelly, VP Advanced Packaging Technology Integration, Amkor Technology |
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B-202: How to Make Chiplets a Viable Market (Panel) (Panel Track) | | Panel Members:
| Panelist: Durgesh Srivastava, Sr Director, NVIDIAPanelist: Clint Walker, VP Marketing, Alphawave SEMIPanelist: Mark Kuemerle, VP/CTO ASIC Business Unit, MarvellPanelist: Travis Lanier, VP Marketing, Ventana Micro SystemsPanelist: Kevin Yee, Director IP Marketing, Samsung Semiconductor |
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B-203: Chiplets in 2028 and How We Got There (Panel) (Panel Track) | | Panel Members:
| Panelist: Tom Hackenberg, Principal Analyst, Yole IntelligencePanelist: John Shalf, Department Head, Lawrence Berkeley National LaboratoryPanelist: Jawad Nasrullah, CEO, Palo Alto ElectronPanelist: Omar Hassen, SVP Business Development, Ventana Micro SystemsPanelist: Bapi Vinnakota, ODSA Project Lead, Open Compute ProjectPanelist: Millind Mittal, VP Data Center Technologies, AMD |
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