TimeActivityTrackRoom-Location

08:00 - Registration (sponsored by Ventana Micro Systems)RegistrationPoolside Foyer

08:15 - 9:00 AMThursday BreakfastRegistrationPoolside Foyer

09:00 - 10:00 AMA-201: InterfacesDesign/Packaging/Interfaces/ApplicationsCarmel

09:00 - 10:00 AMB-201: Partitioning (Disaggregation)Partitioning/Integration/TestMonterey

09:00 - 10:00 AMC-201: Best Packaging for Chiplets Today Panel (sponsored by ASE)PanelsSan Jose

09:00 - 10:00 AMD-201: Annual Update on Test of Multi-Die DesignsAnnual UpdateSanta Clara

10:00 - 10:10 AMThursday AM Refreshment BreakBreakGateway Foyer

10:10 - 10:40 AMKeynote 4: IntelCS 2023 KeynotesCedar/Pine

10:40 - 10:50 AMSpecial Presentation 3: 3DInCitesCS 2023 KeynotesCedar/Pine

10:50 - 11:20 AMKeynote 5: CorigineCS 2023 KeynotesCedar/Pine

11:20 - 11:30 AMSpecial Presentation 4: SNIACS 2023 KeynotesCedar/Pine

11:30 - 12:00 PMKeynote 6: Open Compute ProjectCS 2023 KeynotesCedar/Pine

12:00 - 02:00 PMExhibitsExhibitsFir/Oak

12:00 - 2:00 PMThursday LunchCS 2023 KeynotesGateway Foyer

02:00 - 3:20 PMA-202: Packaging - 2Design/Packaging/Interfaces/ApplicationsCarmel

02:00 - 3:20 PMB-202: How to Make Chiplets a Viable Market (Panel)PanelsSan Jose

02:00 - 3:20 PMC-202: Highlights from University Research on ChipletsAcademicSanta Clara

03:20 - 3:30 PMThursday PM Refreshment BreakBreakPoolside Foyer

03:30 - 4:50 PMA-203: Design - 2Design/Packaging/Interfaces/ApplicationsCarmel

03:30 - 4:50 PMB-203: Chiplets in 2028 and How We Got There (Panel)PanelsSan Jose